Inventor
LAI YU-TING
TW13 patents
⚠️ This page may combine multiple inventors who share the name “LAI YU-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
7 patentsUS6433420B1Aug 13, 2002
Semiconductor package with heat sink having air vent
SILICONWARE PRECISION INDUSTRIES CO LTD94 citations96
US6521997B1Feb 18, 2003
Chip carrier for accommodating passive component
SILICONWARE PRECISION INDUSTRIES CO LTD84 citations95
US6441501B1Aug 27, 2002
Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep
SILICONWARE PRECISION INDUSTRIES CO LTD23 citations89
US7102222B2Sep 5, 2006
Conductive trace structure and semiconductor package having the conductive trace structure
SILICONWARE PRECISION INDUSTRIES CO LTD39 citations87
US6617680B2Sep 9, 2003
Chip carrier, semiconductor package and fabricating method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD36 citations84
US6927485B2Aug 9, 2005
Substrate for semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD12 citations74
US6818538B2Nov 16, 2004
Ball grid array semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD8 citations68
EXPACK IND CORPORATION
5 patentsUS12441075B2Oct 14, 2025
Box folding machine
EXPACK IND CORPORATION2 citations72
US9908303B2Mar 6, 2018
Foldable box sealing machine
EXPACK IND CORPORATION2 citations70
US11365019B2Jun 21, 2022
Strapping machine
EXPACK IND CORPORATION0 citations49
US11267674B2Mar 8, 2022
Strap feeding device for strapping machine
EXPACK IND CORPORATION0 citations49
US11090895B2Aug 17, 2021
Feeding device for a box folding machine
EXPACK IND CORPORATION0 citations49