Inventor
HSU KUN-CHI
TW4 patents
Patents
4 patentsUS10388535B1Aug 20, 2019
Wafer processing method with full edge trimming
POWERTECH TECHNOLOGY INC7 citations73
US11410945B2Aug 9, 2022
Semiconductor package having partial outer metal layer and packaging method thereof
POWERTECH TECHNOLOGY INC0 citations56
US11587808B2Feb 21, 2023
Chip carrier device
POWERTECH TECHNOLOGY INC0 citations45
US11658046B2May 23, 2023
Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations44