Inventor
WU TING-YEH
TW3 patents
Patents
3 patentsUS11410945B2Aug 9, 2022
Semiconductor package having partial outer metal layer and packaging method thereof
POWERTECH TECHNOLOGY INC0 citations56
US11587808B2Feb 21, 2023
Chip carrier device
POWERTECH TECHNOLOGY INC0 citations45
US11658046B2May 23, 2023
Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations44