Inventor
KIM JINGU
KR18 patents
⚠️ This page may combine multiple inventors who share the name “KIM JINGU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS11735553B2Aug 22, 2023
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11417613B2Aug 16, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations71
US11562939B2Jan 24, 2023
Semiconductor package including heat spreader layer
SAMSUNG ELECTRONICS CO LTD2 citations70
US12453107B2Oct 21, 2025
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12040299B2Jul 16, 2024
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11973042B2Apr 30, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11942434B2Mar 26, 2024
Method of manufacturing a semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11569563B2Jan 31, 2023
Semiconductor packages and method of manufacturing semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations61
US11342274B2May 24, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12183694B2Dec 31, 2024
Semiconductor package including antenna
SAMSUNG ELECTRONICS CO LTD0 citations60
US12040248B2Jul 16, 2024
Semiconductor package including heat spreader layer
SAMSUNG ELECTRONICS CO LTD0 citations60
US11637079B2Apr 25, 2023
Semiconductor package including antenna
SAMSUNG ELECTRONICS CO LTD0 citations60
US12575418B2Mar 10, 2026
Semiconductor packages having organic material layer between through-via structure and encapsulant that surrounds a portion of semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations49
US12525526B2Jan 13, 2026
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49