Inventor
LEE YONGKOON
KR12 patents
Patents
12 patentsUS11935849B2Mar 19, 2024
Semiconductor package with an antenna substrate
SAMSUNG ELECTRONICS CO LTD2 citations72
US11735553B2Aug 22, 2023
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11527495B2Dec 13, 2022
Semiconductor package with an antenna substrate
SAMSUNG ELECTRONICS CO LTD2 citations72
US11562939B2Jan 24, 2023
Semiconductor package including heat spreader layer
SAMSUNG ELECTRONICS CO LTD2 citations70
US11329014B2May 10, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US12040299B2Jul 16, 2024
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11569563B2Jan 31, 2023
Semiconductor packages and method of manufacturing semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations61
US12183694B2Dec 31, 2024
Semiconductor package including antenna
SAMSUNG ELECTRONICS CO LTD0 citations60
US12040248B2Jul 16, 2024
Semiconductor package including heat spreader layer
SAMSUNG ELECTRONICS CO LTD0 citations60
US11935847B2Mar 19, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11637079B2Apr 25, 2023
Semiconductor package including antenna
SAMSUNG ELECTRONICS CO LTD0 citations60
US12327826B2Jun 10, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51