Inventor

DUBIN VALERY M

US88 patents

⚠️ This page may combine multiple inventors who share the name “DUBIN VALERY M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DUBIN VALERY M

INTEL CORP

Electroless plating bath composition and method of using

Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs

Designs and methods for conductive bumps

Multiple stage electroless deposition of a metal layer

Method of electroless introduction of interconnect structures

Microcircuit fabrication and interconnection

Interconnect structures and a method of electroless introduction of interconnect structures

Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures

Enhancement of an interconnect

Composite carbon nanotube thermal interface device

Microcircuit fabrication and interconnection

Microcircuit fabrication and interconnection

Methods of fabricating a composite carbon nanotube thermal interface device

Method of copper electroplating

Nanotube growth and device formation

Tunable gate electrode work function material for transistor applications

Apparatus for an improved air gap interconnect structure

Multiple stage electroless deposition of a metal layer

Forming a copper diffusion barrier

Multiple stage electroless deposition of a metal layer

Methods to deposit metal alloy barrier layers

Electroosmotic pump apparatus that generates low amount of hydrogen gas

Method of fabricating a composite carbon nanotube thermal interface device

Apparatus and method for electroless spray deposition

Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface

Composite metal films and carbon nanotube fabrication

Method to assemble structures from nano-materials

Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface

Method and apparatus for an improved air gap interconnect structure

Integrated circuit with metal layer having carbon nanotubes and methods of making same

Metal oxide sensors and method of forming

Forming dual metal complementary metal oxide semiconductor integrated circuits

Method to assemble structures from nano-materials

Nanotubes for integrated circuits

Electroplating chemistries and methods of forming interconnections

Enhancement of an interconnect

Method to fabricate interconnect structures

Wafer with gel-based biochips for electrochemical synthesis and electrical detection of polymers

Catalytic nucleation monolayer for metal seed layers

Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface

CORNELL RES FOUNDATION INC

Electroless deposition equipment or apparatus and method of performing electroless deposition

Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications

Use of cobalt tungsten phosphide as a barrier material for copper metallization

Protected encapsulation of catalytic layer for electroless copper interconnect

ADVANCED MICRO DEVICES INC

Method for filling high aspect ratio openings of an integrated circuit to minimize electromigration failure

Via with barrier layer for impeding diffusion of conductive material from via into insulator

SEMATECH INC

Selective electroless copper deposited interconnect plugs for ULSI applications

LU DAOQIANG

Microelectronic package having direct contact heat spreader and method of manufacturing same

LAVOIE ADRIEN R

Tunable gate electrode work function material for transistor applications

DUBIN VALERY M

Gel-based bio chip for electrochemical synthesis and electrical detection of polymers