Inventor
CALETKA DAVID VINCENT
US11 patents
Patents
11 patentsUS6627998B1Sep 30, 2003
Wafer scale thin film package
IBM58 citations95
US7086147B2Aug 8, 2006
Method of accommodating in volume expansion during solder reflow
IBM40 citations94
US6528892B2Mar 4, 2003
Land grid array stiffener use with flexible chip carriers
IBM108 citations92
US6051982AApr 18, 2000
Electronic component test apparatus with rotational probe and conductive spaced apart means
IBM52 citations92
US5947750ASep 7, 1999
Elastomeric structure with multi-layered elastomer and constraining base
IBM50 citations92
US5804984ASep 8, 1998
Electronic component test apparatus with rotational probe
IBM30 citations92
US6686664B2Feb 3, 2004
Structure to accommodate increase in volume expansion during solder reflow
IBM15 citations91
US6905961B2Jun 14, 2005
Land grid array stiffener for use with flexible chip carriers
IBM2 citations62
US6595784B2Jul 22, 2003
Interposer member having apertures for relieving stress and increasing contact compliancy
IBM6 citations62
US7703199B2Apr 27, 2010
Method to accommodate increase in volume expansion during solder reflow
IBM1 citations61
US7348261B2Mar 25, 2008
Wafer scale thin film package
IBM3 citations61