Inventor
DARBHA KRISHNA
US16 patents
⚠️ This page may combine multiple inventors who share the name “DARBHA KRISHNA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS7086147B2Aug 8, 2006
Method of accommodating in volume expansion during solder reflow
IBM40 citations94
US6631078B2Oct 7, 2003
Electronic package with thermally conductive standoff
IBM62 citations94
US6622786B1Sep 23, 2003
Heat sink structure with pyramidic and base-plate cut-outs
IBM45 citations92
US6686664B2Feb 3, 2004
Structure to accommodate increase in volume expansion during solder reflow
IBM15 citations91
US6649833B1Nov 18, 2003
Negative volume expansion lead-free electrical connection
IBM12 citations73
US6905961B2Jun 14, 2005
Land grid array stiffener for use with flexible chip carriers
IBM2 citations62
US7703199B2Apr 27, 2010
Method to accommodate increase in volume expansion during solder reflow
IBM1 citations61
US6989607B2Jan 24, 2006
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers
IBM0 citations51
US6639302B2Oct 28, 2003
Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries
IBM0 citations51
MICROSOFT CORP
4 patentsUS7454977B2Nov 25, 2008
Force measuring systems for digital pens and other products
MICROSOFT CORP10 citations81
US7233025B2Jun 19, 2007
Electronic packaging for optical emitters and sensors
MICROSOFT CORP17 citations77
US7777722B2Aug 17, 2010
Multi-mode optical navigation
MICROSOFT CORP2 citations60
US7796883B2Sep 14, 2010
Flexible circuit connection
MICROSOFT CORP2 citations56