Inventor

HENDERSON DONALD W

US23 patents

⚠️ This page may combine multiple inventors who share the name “HENDERSON DONALD W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HENDERSON DONALD W

IBM

Composition for increasing activity of a no-clean flux

Method of accommodating in volume expansion during solder reflow

Lead-free tin-silver-copper alloy solder composition

Fluidic cooling systems and methods for electronic components

Flux composition and soldering method for high density arrays

Structure to accommodate increase in volume expansion during solder reflow

Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure

Negative volume expansion lead-free electrical connection

Punch actuator monitoring system and method

Composition for increasing activity of a no-clean flux

Punch actuator monitoring system and method

Anode container, electroplating system, method and plated object

Method to accommodate increase in volume expansion during solder reflow

Additives for grain fragmentation in Pb-free Sn-based solder

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder

Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder

Method and process for reducing undercooling in a lead-free tin-rich solder alloy

Method and process for reducing undercooling in a lead-free tin-rich solder alloy

HENDERSON DONALD W

Cutting implement and method of making same

ARVIN CHARLES L

Additives for grain fragmentation in Pb-free Sn-based solder

GRUBER PETER A

Modification of solder alloy compositions to suppress interfacial void formation in solder joints

BELANGER LUC

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers