Inventor
LEHMAN LAWRENCE P
US7 patents
Patents
7 patentsUS7086147B2Aug 8, 2006
Method of accommodating in volume expansion during solder reflow
IBM40 citations94
US6686664B2Feb 3, 2004
Structure to accommodate increase in volume expansion during solder reflow
IBM15 citations91
US6626196B2Sep 30, 2003
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing
IBM23 citations91
US6649833B1Nov 18, 2003
Negative volume expansion lead-free electrical connection
IBM12 citations73
US6228246B1May 8, 2001
Removal of metal skin from a copper-Invar-copper laminate
IBM7 citations73
US7703199B2Apr 27, 2010
Method to accommodate increase in volume expansion during solder reflow
IBM1 citations61
US6639661B2Oct 28, 2003
Technique for imaging electrical contacts
IBM0 citations51