Inventor
THIEL GEORGE HENRY
US5 patents
Patents
5 patentsUS7086147B2Aug 8, 2006
Method of accommodating in volume expansion during solder reflow
IBM40 citations94
US6686664B2Feb 3, 2004
Structure to accommodate increase in volume expansion during solder reflow
IBM15 citations91
US6226187B1May 1, 2001
Integrated circuit package
IBM21 citations88
US6084299AJul 4, 2000
Integrated circuit package including a heat sink and an adhesive
IBM10 citations69
US7703199B2Apr 27, 2010
Method to accommodate increase in volume expansion during solder reflow
IBM1 citations61