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Inventor
WU JULIA M
US
2 patents
Patents
2 patents
US6919272B2
Jul 19, 2005
Method for patterning densely packed metal segments in a semiconductor die and related structure
NEWPORT FAB LLC
5 citations
58
US7709949B2
May 4, 2010
Densely packed metal segments patterned in a semiconductor die
NEWPORT FAB LLC
0 citations
48