Inventor
SCHROEDER JACK A
US9 patents
⚠️ This page may combine multiple inventors who share the name “SCHROEDER JACK A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
7 patentsUS5742100AApr 21, 1998
Structure having flip-chip connected substrates
MOTOROLA INC150 citations95
US4722914AFeb 2, 1988
Method of making a high density IC module assembly
MOTOROLA INC63 citations94
US4630096ADec 16, 1986
High density IC module assembly
MOTOROLA INC118 citations94
US4513355AApr 23, 1985
Metallization and bonding means and method for VLSI packages
MOTOROLA INC114 citations92
US4933747AJun 12, 1990
Interconnect and cooling system for a semiconductor device
MOTOROLA INC33 citations91
US4933741AJun 12, 1990
Multifunction ground plane
MOTOROLA INC36 citations91
US4805007AFeb 14, 1989
Flip chip module
MOTOROLA INC4 citations61