Inventor
DAVES GLENN G
US24 patents
⚠️ This page may combine multiple inventors who share the name “DAVES GLENN G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS6444496B1Sep 3, 2002
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
IBM123 citations99
US6091603AJul 18, 2000
Customizable lid for improved thermal performance of modules using flip chips
IBM122 citations98
US6878608B2Apr 12, 2005
Method of manufacture of silicon based package
IBM54 citations96
US6292369B1Sep 18, 2001
Methods for customizing lid for improved thermal performance of modules using flip chips
IBM82 citations96
US6275381B1Aug 14, 2001
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
IBM65 citations96
US7079393B2Jul 18, 2006
Fluidic cooling systems and methods for electronic components
IBM44 citations92
US7268570B1Sep 11, 2007
Apparatus and method for customized burn-in of cores on a multicore microprocessor integrated circuit chip
IBM24 citations91
US5838545ANov 17, 1998
High performance, low cost multi-chip modle package
IBM59 citations91
US7420378B2Sep 2, 2008
Power grid structure to optimize performance of a multiple core processor
IBM12 citations83
US7445141B2Nov 4, 2008
Solder interconnection array with optimal mechanical integrity
IBM8 citations74
US6541365B2Apr 1, 2003
Insulating interposer between two electronic components and process thereof
IBM8 citations74
US6365977B1Apr 2, 2002
Insulating interposer between two electronic components and process thereof
IBM7 citations74
US7239516B2Jul 3, 2007
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
IBM7 citations73
US6762489B2Jul 13, 2004
Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules
IBM12 citations68
US7900809B2Mar 8, 2011
Solder interconnection array with optimal mechanical integrity
IBM3 citations63
US7667470B2Feb 23, 2010
Power grid structure to optimize performance of a multiple core processor
IBM3 citations62
US6974722B2Dec 13, 2005
Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules
IBM4 citations57
GONG ZHIWEI
3 patentsUS8916421B2Dec 23, 2014
Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
GONG ZHIWEI65 citations97
US8597983B2Dec 3, 2013
Semiconductor device packaging having substrate with pre-encapsulation through via formation
GONG ZHIWEI10 citations84
US9142502B2Sep 22, 2015
Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
GONG ZHIWEI9 citations83