Inventor
SCHMID ULRICH
DE38 patents
⚠️ This page may combine multiple inventors who share the name “SCHMID ULRICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
10 patentsUS10710874B2Jul 14, 2020
Micromechanical structure and method for manufacturing the same
INFINEON TECHNOLOGIES AG9 citations83
US11237090B2Feb 1, 2022
Sensor element, particle sensor device and method for detecting a particulate matter density
INFINEON TECHNOLOGIES AG3 citations72
US9212045B1Dec 15, 2015
Micro mechanical structure and method for fabricating the same
INFINEON TECHNOLOGIES AG6 citations72
US10516943B2Dec 24, 2019
Microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device
INFINEON TECHNOLOGIES AG2 citations70
US10582304B2Mar 3, 2020
Diaphragm element arrangement and related method
INFINEON TECHNOLOGIES AG0 citations51
US10081533B2Sep 25, 2018
Micromechanical structure and method for fabricating the same
INFINEON TECHNOLOGIES AG1 citations50
US9939331B2Apr 10, 2018
System and method for a capacitive thermometer
INFINEON TECHNOLOGIES AG0 citations48
US10462580B2Oct 29, 2019
Microelectromechanical loudspeaker
INFINEON TECHNOLOGIES AG0 citations47
US10684163B2Jun 16, 2020
Acoustic wave sensor
INFINEON TECHNOLOGIES AG0 citations41
US10106398B2Oct 23, 2018
Micromechanical structure comprising carbon material and method for fabricating the same
INFINEON TECHNOLOGIES AG0 citations40
INFINEON TECHNOLOGIES AUSTRIA AG
4 patentsUS11677023B2Jun 13, 2023
Semiconductor device
INFINEON TECHNOLOGIES AUSTRIA AG0 citations50
US10763339B2Sep 1, 2020
Method for manufacturing a semiconductor device having a Schottky contact
INFINEON TECHNOLOGIES AUSTRIA AG0 citations49
US10431698B2Oct 1, 2019
Semiconductor device with non-ohmic contact between SiC and a contact layer containing metal nitride
INFINEON TECHNOLOGIES AUSTRIA AG0 citations49
US10199514B2Feb 5, 2019
Methods for manufacturing a semiconductor device having a non-ohmic contact formed between a semiconductor material and an electrically conductive contact layer
INFINEON TECHNOLOGIES AUSTRIA AG0 citations49
SCHWANKE DIETER
3 patentsUS8586178B2Nov 19, 2013
Ceramic substrate material, method for the production and use thereof, and antenna or antenna array
SCHWANKE DIETER15 citations88
US8128885B2Mar 6, 2012
Microreactor and method for manufacturing same and method for manufacturing a substrate for a microreactor
SCHWANKE DIETER6 citations69
US8529780B2Sep 10, 2013
Ceramic substrate material, method for the production and use thereof, and antenna or antenna array
SCHWANKE DIETER0 citations37
BAYERISCHE MOTOREN WERKE AG
3 patentsUS12560188B2Feb 24, 2026
Method for joining components and component composite
BAYERISCHE MOTOREN WERKE AG0 citations50
US11878333B2Jan 23, 2024
Method for hot forming a semifinished product, in particular in sheet form
BAYERISCHE MOTOREN WERKE AG0 citations49
US11873537B2Jan 16, 2024
Method for producing a profiled component, and profiled component
BAYERISCHE MOTOREN WERKE AG0 citations37
UNIV WIEN TECH
2 patentsEOS GMBH ELECTRO OPTICAL SYSTEMS
2 patentsUS10946581B2Mar 16, 2021
Method for calibrating an apparatus for manufacturing a three-dimensional object
EOS GMBH ELECTRO OPTICAL SYSTEMS3 citations69
US12240165B2Mar 4, 2025
Metering device, device and method for additively producing a three-dimensional object
EOS GMBH ELECTRO OPTICAL SYSTEMS0 citations51