Inventor
YANG CHEN-HSIUNG
TW19 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHEN-HSIUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOUCH MICRO SYSTEM TECH
11 patentsUS7008821B1Mar 7, 2006
Method of forming a wafer backside interconnecting wire
TOUCH MICRO SYSTEM TECH21 citations88
US7505118B2Mar 17, 2009
Wafer carrier
TOUCH MICRO SYSTEM TECH8 citations83
US7306955B2Dec 11, 2007
Method of performing a double-sided process
TOUCH MICRO SYSTEM TECH5 citations72
US7297610B2Nov 20, 2007
Method of segmenting a wafer
TOUCH MICRO SYSTEM TECH5 citations61
US7192842B2Mar 20, 2007
Method for bonding wafers
TOUCH MICRO SYSTEM TECH3 citations58
US7566574B2Jul 28, 2009
Method of performing a double-sided process
TOUCH MICRO SYSTEM TECH0 citations51
US7256128B2Aug 14, 2007
Method of double-sided etching
TOUCH MICRO SYSTEM TECH0 citations51
US7582511B2Sep 1, 2009
Method for wafer level chip scale packaging with passive components integrated into packaging structure
TOUCH MICRO SYSTEM TECH0 citations40
US7045463B2May 16, 2006
Method of etching cavities having different aspect ratios
TOUCH MICRO SYSTEM TECH0 citations40
US7531457B2May 12, 2009
Method of fabricating suspended structure
TOUCH MICRO SYSTEM TECH0 citations39
US7465601B2Dec 16, 2008
Method of forming suspended structure
TOUCH MICRO SYSTEM TECH0 citations39
TAIWAN SEMICONDUCTOR MFG CO LTD
7 patentsUS9550667B1Jan 24, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations83
US11186481B2Nov 30, 2021
Sensor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11206493B2Dec 21, 2021
Sensor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12421103B2Sep 23, 2025
Microelectromechanical system device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11577954B2Feb 14, 2023
Method for forming semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10865099B2Dec 15, 2020
MEMS device and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10087071B2Oct 2, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51