Inventor

HAUENSTEIN HENNING M

US22 patents

⚠️ This page may combine multiple inventors who share the name “HAUENSTEIN HENNING M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAUENSTEIN HENNING M

INT RECTIFIER CORP

Package for high power density devices

Semiconductor device assembly utilizing a DBC substrate

Wafer scale package for high power devices

Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules

Dual compartment semiconductor package

Semiconductor package having internal shunt and solder stop dimples

Driver IC with HV-isolation, especially hybrid electric vehicle motor drive concept

Gate-driver IC with HV-isolation, especially hybrid electric vehicle motor drive concept

Power module with current routing

Semiconductor package with temperature sensor

Semiconductor package for high power devices

Bondwireless power module with three-dimensional current routing

HAUENSTEIN HENNING M

Stacked half-bridge power module

Bond wireless power module with double-sided single device cooling and immersion bath cooling

Package for high power devices

Semiconductor device package with internal device protection

Power module with press-fit clamps

Power semiconductor package with double-sided cooling

Dual compartment semiconductor package with temperature sensor

BOSCH GMBH ROBERT

Method for determining temperatures on semiconductor components

Device for sensing a magnetic field, magnetic field meter and an ammeter

INFINEON TECHNOLOGIES AMERICAS CORP

Wafer scale package for high power devices