Inventor
REN YUPING
US13 patents
⚠️ This page may combine multiple inventors who share the name “REN YUPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
12 patentsUS10395926B1Aug 27, 2019
Multiple patterning with mandrel cuts formed using a block mask
GLOBALFOUNDRIES INC11 citations81
US10319626B1Jun 11, 2019
Interconnects with cuts formed by block patterning
GLOBALFOUNDRIES INC4 citations72
US9666476B2May 30, 2017
Dimension-controlled via formation processing
GLOBALFOUNDRIES INC2 citations72
US9817927B2Nov 14, 2017
Hard mask etch and dielectric etch aware overlap for via and metal layers
GLOBALFOUNDRIES INC2 citations68
US10923388B2Feb 16, 2021
Gap fill void and connection structures
GLOBALFOUNDRIES INC1 citations62
US9305832B2Apr 5, 2016
Dimension-controlled via formation processing
GLOBALFOUNDRIES INC2 citations62
US10777413B2Sep 15, 2020
Interconnects with non-mandrel cuts formed by early block patterning
GLOBALFOUNDRIES INC0 citations51
US10770344B2Sep 8, 2020
Chamferless interconnect vias of semiconductor devices
GLOBALFOUNDRIES INC0 citations51
US10002827B2Jun 19, 2018
Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device
GLOBALFOUNDRIES INC1 citations51
US9672313B2Jun 6, 2017
Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device
GLOBALFOUNDRIES INC0 citations51
US10600914B2Mar 24, 2020
Isolation pillar first gate structures and methods of forming same
GLOBALFOUNDRIES INC0 citations39
US10566291B2Feb 18, 2020
Mark structure for aligning layers of integrated circuit structure and methods of forming same
GLOBALFOUNDRIES INC0 citations36