Inventor

DESLANDES HERVE

US10 patents

⚠️ This page may combine multiple inventors who share the name “DESLANDES HERVE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FEI EFA INC

4 patents

US10620263B2Apr 14, 2020

System and method for fault isolation by emission spectra analysis

FEI EFA INC0 citations50

US10041997B2Aug 7, 2018

System and method for fault isolation by emission spectra analysis

FEI EFA INC0 citations50

US9817060B2Nov 14, 2017

Optimized wavelength photon emission microscope for VLSI devices

FEI EFA INC1 citations49

US9903824B2Feb 27, 2018

Spectral mapping of photo emission

FEI EFA INC0 citations45

DCG SYSTEMS INC

2 patents

US9322715B2Apr 26, 2016

Three-dimensional hot spot localization

DCG SYSTEMS INC3 citations69

US9098892B2Aug 4, 2015

Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side

DCG SYSTEMS INC3 citations59

FEI CO

2 patents

US10514418B2Dec 24, 2019

Optimized wavelength photon emission microscope for VLSI devices

FEI CO0 citations49

US10049949B2Aug 14, 2018

In-situ packaging decapsulation feature for electrical fault localization

FEI CO0 citations41

ALTMANN FRANK

1 patent

US8742347B2Jun 3, 2014

Three-dimensional hot spot localization

ALTMANN FRANK20 citations86

DESLANDES HERVE

1 patent

US9025020B2May 5, 2015

Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side

DESLANDES HERVE14 citations76