Inventor
WONG CHENG-CHOU
TW5 patents
⚠️ This page may combine multiple inventors who share the name “WONG CHENG-CHOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
4 patentsUS8373991B2Feb 12, 2013
Metal thermal interface material and thermal module and packaged microelectronic component containing the material
IND TECH RES INST7 citations78
US7952192B2May 31, 2011
Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof
IND TECH RES INST3 citations58
US7576428B2Aug 18, 2009
Melting temperature adjustable metal thermal interface materials and application thereof
IND TECH RES INST2 citations58
US9397279B2Jul 19, 2016
Electric conductive heat dissipation substrate
IND TECH RES INST0 citations32