Inventor
CHEN HSIN-EN
TW6 patents
Patents
6 patentsUS11282767B2Mar 22, 2022
Semiconductor package structure and electronic device
ADVANCED SEMICONDUCTOR ENG2 citations68
US11081420B2Aug 3, 2021
Substrate structure and semiconductor package structure
ADVANCED SEMICONDUCTOR ENG0 citations60
US11024557B2Jun 1, 2021
Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die
ADVANCED SEMICONDUCTOR ENG0 citations59
US11139226B2Oct 5, 2021
Semiconductor package structure and assembly structure
ADVANCED SEMICONDUCTOR ENG0 citations58
US11205606B2Dec 21, 2021
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations57
US10685899B2Jun 16, 2020
Conductive lid and semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations45