Inventor
MURATA MICHIAKI
JP46 patents
⚠️ This page may combine multiple inventors who share the name “MURATA MICHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJI XEROX CO LTD
30 patentsUS6378994B1Apr 30, 2002
Liquid jet printing head and method for manufacturing the same
FUJI XEROX CO LTD35 citations91
US9385268B2Jul 5, 2016
Method of manufacturing semiconductor chips
FUJI XEROX CO LTD15 citations84
US7448731B2Nov 11, 2008
Liquid droplet ejecting head and liquid droplet ejecting device
FUJI XEROX CO LTD14 citations84
US9735056B2Aug 15, 2017
Semiconductor piece manufacturing method and substrate dicing method for suppressing breakage
FUJI XEROX CO LTD12 citations83
US9589812B2Mar 7, 2017
Fabrication method of semiconductor piece
FUJI XEROX CO LTD16 citations83
US9997363B2Jun 12, 2018
Method for producing semiconductor piece, circuit board and electronic device including semiconductor piece, and method for designing etching condition
FUJI XEROX CO LTD13 citations82
US7469993B2Dec 30, 2008
Inkjet recording head
FUJI XEROX CO LTD7 citations74
US6527371B2Mar 4, 2003
Ink jet recording head, ink jet recording device and head manufacturing method
FUJI XEROX CO LTD7 citations74
US9865468B2Jan 9, 2018
Method of positioning cutting member to semiconductor chip with grooves
FUJI XEROX CO LTD3 citations73
US7047642B2May 23, 2006
Process for producing ink jet recording head
FUJI XEROX CO LTD7 citations73
US6634741B2Oct 21, 2003
Ink jet recording head, ink jet recording device and head manufacturing method
FUJI XEROX CO LTD12 citations73
US9754833B2Sep 5, 2017
Method for manufacturing semiconductor chip that includes dividing substrate by etching groove along cutting region of substrate combined with forming modified region by laser irradiating along cutting region in substrate
FUJI XEROX CO LTD2 citations72
US6527903B1Mar 4, 2003
Substrate bonding method, bonded product, ink jet head, and image forming apparatus
FUJI XEROX CO LTD8 citations72
US6254222B1Jul 3, 2001
Liquid jet recording apparatus with flow channels for jetting liquid and a method for fabricating the same
FUJI XEROX CO LTD9 citations69
US7735977B2Jun 15, 2010
Droplet discharging head and inkjet recording apparatus
FUJI XEROX CO LTD2 citations63
US7524024B2Apr 28, 2009
Electrical connection substrate, droplet discharge head, and droplet discharge apparatus
FUJI XEROX CO LTD6 citations63
US7416286B2Aug 26, 2008
Inkjet recording head and inkjet recording device
FUJI XEROX CO LTD5 citations63
US7607761B2Oct 27, 2009
Droplet discharging head and manufacturing method for the same, and droplet discharging device
FUJI XEROX CO LTD2 citations62
US7448733B2Nov 11, 2008
Liquid droplet ejecting head and liquid droplet ejecting device
FUJI XEROX CO LTD4 citations62
US10477732B2Nov 12, 2019
Light irradiation device, light irradiation system, and image forming apparatus
FUJI XEROX CO LTD1 citations60
US9802402B2Oct 31, 2017
Method of manufacturing heating device by screen printing
FUJI XEROX CO LTD0 citations52
US9673351B2Jun 6, 2017
Method of manufacturing semiconductor chips
FUJI XEROX CO LTD1 citations52
US9368406B2Jun 14, 2016
Method for manufacturing semiconductor chip
FUJI XEROX CO LTD0 citations52
US7988263B2Aug 2, 2011
Liquid droplet ejection head, liquid droplet ejection device, and image forming apparatus
FUJI XEROX CO LTD1 citations52
US7427821B2Sep 23, 2008
Piezoelectric element, inkjet recording head and inkjet recording device
FUJI XEROX CO LTD0 citations52
US9673080B2Jun 6, 2017
Semiconductor piece manufacturing method
FUJI XEROX CO LTD1 citations51
US9455173B2Sep 27, 2016
Semiconductor piece manufacturing method
FUJI XEROX CO LTD0 citations51
US7658468B2Feb 9, 2010
Ink jet recording head and method of manufacturing the same
FUJI XEROX CO LTD0 citations51
US7445318B2Nov 4, 2008
Method of manufacturing liquid droplet ejection head, liquid droplet ejection head, and liquid droplet ejection apparatus
FUJI XEROX CO LTD0 citations42
US9508595B2Nov 29, 2016
Method of tip shape of cutting member, semiconductor chip manufacturing method, circuit board, and electronic apparatus
FUJI XEROX CO LTD0 citations38
FUJIFILM BUSINESS INNOVATION CORP
8 patentsUS11657130B2May 23, 2023
Light emitter, light emitting device, optical device, and information processing apparatus
FUJIFILM BUSINESS INNOVATION CORP2 citations73
US12517253B2Jan 6, 2026
Light emitting device, optical device, and information processing apparatus
FUJIFILM BUSINESS INNOVATION CORP0 citations62
US12481737B2Nov 25, 2025
Light emitter, light emitting device, optical device, and information processing apparatus
FUJIFILM BUSINESS INNOVATION CORP0 citations62
US12476439B2Nov 18, 2025
Light-emitting component, light-emitting element array chip, and optical measurement apparatus
FUJIFILM BUSINESS INNOVATION CORP0 citations62
US12027510B2Jul 2, 2024
Light-emitting element array chip, light-emitting device, optical device, and information processing device
FUJIFILM BUSINESS INNOVATION CORP1 citations62
US11081344B2Aug 3, 2021
Method for manufacturing semiconductor substrate
FUJIFILM BUSINESS INNOVATION CORP0 citations58
US12261414B2Mar 25, 2025
Light-emission device, optical device, and information processing device
FUJIFILM BUSINESS INNOVATION CORP0 citations52
US11953308B2Apr 9, 2024
Light emitting element array and optical measuring system
FUJIFILM BUSINESS INNOVATION CORP0 citations52
MURATA MICHIAKI
2 patentsTANAKA KUMIKO
2 patentsNAYVE REGAN
2 patentsUS8585186B2Nov 19, 2013
Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device
NAYVE REGAN0 citations45
US8177334B2May 15, 2012
Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device
NAYVE REGAN0 citations45