P

Inventor

MURATA MICHIAKI

JP46 patents
⚠️ This page may combine multiple inventors who share the name “MURATA MICHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJI XEROX CO LTD

30 patents
US6378994B1Apr 30, 2002

Liquid jet printing head and method for manufacturing the same

FUJI XEROX CO LTD35 citations91
US9385268B2Jul 5, 2016

Method of manufacturing semiconductor chips

FUJI XEROX CO LTD15 citations84
US7448731B2Nov 11, 2008

Liquid droplet ejecting head and liquid droplet ejecting device

FUJI XEROX CO LTD14 citations84
US9735056B2Aug 15, 2017

Semiconductor piece manufacturing method and substrate dicing method for suppressing breakage

FUJI XEROX CO LTD12 citations83
US9589812B2Mar 7, 2017

Fabrication method of semiconductor piece

FUJI XEROX CO LTD16 citations83
US9997363B2Jun 12, 2018

Method for producing semiconductor piece, circuit board and electronic device including semiconductor piece, and method for designing etching condition

FUJI XEROX CO LTD13 citations82
US7469993B2Dec 30, 2008

Inkjet recording head

FUJI XEROX CO LTD7 citations74
US6527371B2Mar 4, 2003

Ink jet recording head, ink jet recording device and head manufacturing method

FUJI XEROX CO LTD7 citations74
US9865468B2Jan 9, 2018

Method of positioning cutting member to semiconductor chip with grooves

FUJI XEROX CO LTD3 citations73
US7047642B2May 23, 2006

Process for producing ink jet recording head

FUJI XEROX CO LTD7 citations73
US6634741B2Oct 21, 2003

Ink jet recording head, ink jet recording device and head manufacturing method

FUJI XEROX CO LTD12 citations73
US9754833B2Sep 5, 2017

Method for manufacturing semiconductor chip that includes dividing substrate by etching groove along cutting region of substrate combined with forming modified region by laser irradiating along cutting region in substrate

FUJI XEROX CO LTD2 citations72
US6527903B1Mar 4, 2003

Substrate bonding method, bonded product, ink jet head, and image forming apparatus

FUJI XEROX CO LTD8 citations72
US6254222B1Jul 3, 2001

Liquid jet recording apparatus with flow channels for jetting liquid and a method for fabricating the same

FUJI XEROX CO LTD9 citations69
US7735977B2Jun 15, 2010

Droplet discharging head and inkjet recording apparatus

FUJI XEROX CO LTD2 citations63
US7524024B2Apr 28, 2009

Electrical connection substrate, droplet discharge head, and droplet discharge apparatus

FUJI XEROX CO LTD6 citations63
US7416286B2Aug 26, 2008

Inkjet recording head and inkjet recording device

FUJI XEROX CO LTD5 citations63
US7607761B2Oct 27, 2009

Droplet discharging head and manufacturing method for the same, and droplet discharging device

FUJI XEROX CO LTD2 citations62
US7448733B2Nov 11, 2008

Liquid droplet ejecting head and liquid droplet ejecting device

FUJI XEROX CO LTD4 citations62
US10477732B2Nov 12, 2019

Light irradiation device, light irradiation system, and image forming apparatus

FUJI XEROX CO LTD1 citations60
US9802402B2Oct 31, 2017

Method of manufacturing heating device by screen printing

FUJI XEROX CO LTD0 citations52
US9673351B2Jun 6, 2017

Method of manufacturing semiconductor chips

FUJI XEROX CO LTD1 citations52
US9368406B2Jun 14, 2016

Method for manufacturing semiconductor chip

FUJI XEROX CO LTD0 citations52
US7988263B2Aug 2, 2011

Liquid droplet ejection head, liquid droplet ejection device, and image forming apparatus

FUJI XEROX CO LTD1 citations52
US7427821B2Sep 23, 2008

Piezoelectric element, inkjet recording head and inkjet recording device

FUJI XEROX CO LTD0 citations52
US9673080B2Jun 6, 2017

Semiconductor piece manufacturing method

FUJI XEROX CO LTD1 citations51
US9455173B2Sep 27, 2016

Semiconductor piece manufacturing method

FUJI XEROX CO LTD0 citations51
US7658468B2Feb 9, 2010

Ink jet recording head and method of manufacturing the same

FUJI XEROX CO LTD0 citations51
US7445318B2Nov 4, 2008

Method of manufacturing liquid droplet ejection head, liquid droplet ejection head, and liquid droplet ejection apparatus

FUJI XEROX CO LTD0 citations42
US9508595B2Nov 29, 2016

Method of tip shape of cutting member, semiconductor chip manufacturing method, circuit board, and electronic apparatus

FUJI XEROX CO LTD0 citations38

FUJIFILM BUSINESS INNOVATION CORP

8 patents

MURATA MICHIAKI

2 patents

TANAKA KUMIKO

2 patents

NAYVE REGAN

2 patents

FUJIFILM CORP

1 patent

KINOSHITA TAKU

1 patent