P

Inventor

SON JAE HYUN

KR14 patents
⚠️ This page may combine multiple inventors who share the name “SON JAE HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COUPANG CORP

4 patents
US11080636B1Aug 3, 2021

Systems and method for workflow editing

COUPANG CORP12 citations84
US11822571B2Nov 21, 2023

Systems and methods for managing event storage

COUPANG CORP0 citations61
US11593742B2Feb 28, 2023

Systems and method for workflow editing

COUPANG CORP0 citations61
US11256714B1Feb 22, 2022

Systems and methods for managing event storage

COUPANG CORP1 citations61

KANG TAE MIN

3 patents
US8680688B2Mar 25, 2014

Stack package having flexible conductors

KANG TAE MIN5 citations70
US8288873B2Oct 16, 2012

Stack package having flexible conductors

KANG TAE MIN5 citations70
US8164200B2Apr 24, 2012

Stack semiconductor package and method for manufacturing the same

KANG TAE MIN0 citations37

SK HYNIX INC

3 patents
US9390997B2Jul 12, 2016

Semiconductor chip and stacked type semiconductor package having the same

SK HYNIX INC6 citations69
US11270923B2Mar 8, 2022

Semiconductor packages including a heat insulation wall

SK HYNIX INC0 citations56
US10600713B2Mar 24, 2020

Semiconductor packages including a heat insulation wall

SK HYNIX INC1 citations56

NA YUN-SUNG

2 patents
US8496113B2Jul 30, 2013

Insert for carrier board of test handler

NA YUN-SUNG7 citations82
US8523158B2Sep 3, 2013

Opener and buffer table for test handler

NA YUN-SUNG0 citations39

HYNIX SEMICONDUCTOR INC

1 patent
US8044301B2Oct 25, 2011

Printed circuit board provided with heat circulating medium and method for manufacturing the same

HYNIX SEMICONDUCTOR INC7 citations82

LEE DAE WOONG

1 patent
US8810309B2Aug 19, 2014

Stack package and method for selecting chip in stack package

LEE DAE WOONG3 citations57