Inventor
GUO SONG
US40 patents
⚠️ This page may combine multiple inventors who share the name “GUO SONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
11 patentsUS9099309B2Aug 4, 2015
Method providing an epitaxial growth having a reduction in defects and resulting structure
MICRON TECHNOLOGY INC5 citations73
US11501804B2Nov 15, 2022
Microelectronic devices including semiconductive pillar structures, and related electronic systems
MICRON TECHNOLOGY INC2 citations72
US11201154B2Dec 14, 2021
Methods of forming an apparatus including device structures including pillar structures, and related memory devices, and electronic systems
MICRON TECHNOLOGY INC2 citations72
US10593678B1Mar 17, 2020
Methods of forming semiconductor devices using aspect ratio dependent etching effects, and related semiconductor devices
MICRON TECHNOLOGY INC2 citations70
US11925014B2Mar 5, 2024
Apparatuses including elongate pillars of access devices
MICRON TECHNOLOGY INC0 citations61
US10991700B2Apr 27, 2021
Methods of forming semiconductor devices using aspect ratio dependent etching effects, and related memory devices and electronic systems
MICRON TECHNOLOGY INC0 citations60
US11812603B2Nov 7, 2023
Microelectronic devices including semiconductive pillar structures, and related electronic systems
MICRON TECHNOLOGY INC0 citations52
US9356096B2May 31, 2016
Method providing an epitaxial growth having a reduction in defects and resulting structure
MICRON TECHNOLOGY INC0 citations52
US11877434B2Jan 16, 2024
Microelectronic devices having features with a fin portion of different sidewall slope than a lower portion, and related methods and electronic systems
MICRON TECHNOLOGY INC0 citations51
US11594536B2Feb 28, 2023
Integrated assemblies and semiconductor memory devices
MICRON TECHNOLOGY INC0 citations49
US12022647B2Jun 25, 2024
Microelectronic devices including memory cell structures, and related methods and electronic systems
MICRON TECHNOLOGY INC0 citations46
JIANGSU LEUVEN INSTR CO LTD
6 patentsUS12531215B2Jan 20, 2026
Plasma processing system and multi-section faraday shielding device thereof
JIANGSU LEUVEN INSTR CO LTD0 citations50
US12243713B2Mar 4, 2025
Anti-breakdown ion source discharge apparatus
JIANGSU LEUVEN INSTR CO LTD0 citations50
US12009188B2Jun 11, 2024
Rotatable faraday cleaning apparatus and plasma processing system
JIANGSU LEUVEN INSTR CO LTD0 citations50
US11955323B2Apr 9, 2024
Device for blocking plasma backflow in process chamber to protect air inlet structure
JIANGSU LEUVEN INSTR CO LTD0 citations50
US11837439B2Dec 5, 2023
Inductively coupled plasma treatment system
JIANGSU LEUVEN INSTR CO LTD0 citations50
US11735400B2Aug 22, 2023
Faraday cleaning device and plasma processing system
JIANGSU LEUVEN INSTR CO LTD0 citations50
TEXAS INSTRUMENTS INC
5 patentsUS9317049B2Apr 19, 2016
Emulated current ramp for DC-DC converter
TEXAS INSTRUMENTS INC7 citations84
US9548651B2Jan 17, 2017
Advanced control circuit for switched-mode DC-DC converter
TEXAS INSTRUMENTS INC5 citations73
US12483135B2Nov 25, 2025
Methods and apparatus to improve transient response performance of buck regulators
TEXAS INSTRUMENTS INC0 citations62
US10931196B2Feb 23, 2021
Load transient and jitter of DC-DC converter
TEXAS INSTRUMENTS INC0 citations62
US11799369B2Oct 24, 2023
Current sensing with capacitive compensation
TEXAS INSTRUMENTS INC0 citations52
SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD
5 patentsUS11551948B2Jan 10, 2023
Semiconductor manufacturing apparatus
SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD2 citations71
US11037900B2Jun 15, 2021
Chip bonding device and bonding method thereof
SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD0 citations49
US10903105B2Jan 26, 2021
Flip chip bonding device and bonding method
SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD0 citations45
US10770320B2Sep 8, 2020
Universal chip batch-bonding apparatus and method
SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD0 citations39
US10763235B2Sep 1, 2020
Batch bonding apparatus and bonding method
SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD0 citations39