P

Inventor

JEONG SANG-SUP

KR31 patents
⚠️ This page may combine multiple inventors who share the name “JEONG SANG-SUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

23 patents
US6617253B1Sep 9, 2003

Plasma etching method using polymer deposition and method of forming contact hole using the plasma etching method

SAMSUNG ELECTRONICS CO LTD465 citations99
US6461911B2Oct 8, 2002

Semiconductor memory device and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD129 citations98
US6573551B1Jun 3, 2003

Semiconductor memory device having self-aligned contact and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD23 citations92
US5903351AMay 11, 1999

Method and apparatus for selective spectroscopic analysis of a wafer surface and gas phase elements in a reaction chamber

SAMSUNG ELECTRONICS CO LTD29 citations92
US6177320B1Jan 23, 2001

Method for forming a self aligned contact in a semiconductor device

SAMSUNG ELECTRONICS CO LTD50 citations91
US7572711B2Aug 11, 2009

Method of manufacturing a semiconductor device

SAMSUNG ELECTRONICS CO LTD15 citations84
US7438765B2Oct 21, 2008

Adjustable shielding plate for adjusting an etching area of a semiconductor wafer and related apparatus and methods

SAMSUNG ELECTRONICS CO LTD11 citations84
US6461975B1Oct 8, 2002

Method of etching insulating layer in semiconductor device

SAMSUNG ELECTRONICS CO LTD16 citations84
US6348375B1Feb 19, 2002

Method of fabricating a bit line structure for a semiconductor device

SAMSUNG ELECTRONICS CO LTD14 citations84
US6337275B1Jan 8, 2002

Method for forming a self aligned contact in a semiconductor device

SAMSUNG ELECTRONICS CO LTD14 citations84
US8790976B2Jul 29, 2014

Method of forming semiconductor device having self-aligned plug

SAMSUNG ELECTRONICS CO LTD5 citations83
US6451663B1Sep 17, 2002

Method of manufacturing a cylindrical storage node in a semiconductor device

SAMSUNG ELECTRONICS CO LTD11 citations73
US7091117B2Aug 15, 2006

Method of fabricating a semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations63
US7557026B2Jul 7, 2009

Contact structure and method of forming the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US7109080B2Sep 19, 2006

Method of forming capacitor over bitline contact

SAMSUNG ELECTRONICS CO LTD4 citations62
US8053358B2Nov 8, 2011

Methods of forming integrated circuit devices using contact hole spacers to improve contact isolation

SAMSUNG ELECTRONICS CO LTD4 citations61
US7875551B2Jan 25, 2011

Methods of forming integrated circuit devices using contact hole spacers to improve contact isolation

SAMSUNG ELECTRONICS CO LTD3 citations61
US7161205B2Jan 9, 2007

Semiconductor memory device with cylindrical storage electrode and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations61
US8017485B2Sep 13, 2011

Methods of fabricating a semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations60
US8003487B2Aug 23, 2011

Methods of manufacturing a semiconductor device using a layer suspended across a trench

SAMSUNG ELECTRONICS CO LTD4 citations58
US7863677B2Jan 4, 2011

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US6682975B2Jan 27, 2004

Semiconductor memory device having self-aligned contact and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD0 citations52
US7312117B2Dec 25, 2007

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations51

PARK JONG-CHUL

5 patents

OH GYU-HWAN

1 patent

KIM JONG-KYU

1 patent

KANG YUN-SEUNG

1 patent