Inventor

FUJISAKI KOJI

JP19 patents

⚠️ This page may combine multiple inventors who share the name “FUJISAKI KOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJISAKI KOJI

HITACHI LTD

Resin encapsulated semiconductor device

Low thermal expansion resin material and composite shaped article

Low thermal expansion resin material and composite shaped article

Fluorine-containing polyamide-acid derivative and polyimide

Process of forming a patterned polyimide film and articles including such a film

Method for forming polyimide film by chemical vapor deposition

Process for producing metal-polyimide composite article

Method for forming multilayer wiring construction

Sensor characteristic evaluation method and charged particle beam device

Acid anhydride complex and process for producing same, and composition containing same

Silicon carbide semiconductor device and manufacturing method of the same

HITACHI CHEMICAL CO LTD

Abrasive, abrasive set, and method for abrading substrate

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

Polishing agent, polishing agent set and method for polishing base

Abrasive, abrasive set, and method for abrading substrate

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

Polishing agent, polishing agent set, and substrate polishing method

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate