Inventor
CHIDAMBARRAO DURESETI
US232 patents
⚠️ This page may combine multiple inventors who share the name “CHIDAMBARRAO DURESETI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
47 patentsUS7683428B2Mar 23, 2010
Vertical Fin-FET MOS devices
IBM221 citations99
US7247534B2Jul 24, 2007
Silicon device on Si:C-OI and SGOI and method of manufacture
IBM95 citations99
US7198995B2Apr 3, 2007
Strained finFETs and method of manufacture
IBM154 citations99
US6977194B2Dec 20, 2005
Structure and method to improve channel mobility by gate electrode stress modification
IBM225 citations99
US6891192B2May 10, 2005
Structure and method of making strained semiconductor CMOS transistors having lattice-mismatched semiconductor regions underlying source and drain regions
IBM179 citations99
US6881635B1Apr 19, 2005
Strained silicon NMOS devices with embedded source/drain
IBM176 citations99
US6825529B2Nov 30, 2004
Stress inducing spacers
IBM234 citations99
US6717216B1Apr 6, 2004
SOI based field effect transistor having a compressive film in undercut area under the channel and a method of making the device
IBM282 citations99
US7388259B2Jun 17, 2008
Strained finFET CMOS device structures
IBM61 citations98
US7358551B2Apr 15, 2008
Structure and method for improved stress and yield in pFETs with embedded SiGe source/drain regions
IBM76 citations98
US6974981B2Dec 13, 2005
Isolation structures for imposing stress patterns
IBM137 citations98
US6972461B1Dec 6, 2005
Channel MOSFET with strained silicon channel on strained SiGe
IBM97 citations98
US6417572B1Jul 9, 2002
Process for producing metal interconnections and product produced thereby
IBM105 citations98
US7060539B2Jun 13, 2006
Method of manufacture of FinFET devices with T-shaped fins and devices manufactured thereby
IBM123 citations97
US7018551B2Mar 28, 2006
Pull-back method of forming fins in FinFets
IBM84 citations97
US7337420B2Feb 26, 2008
Methodology for layout-based modulation and optimization of nitride liner stress effect in compact models
IBM61 citations96
US7303949B2Dec 4, 2007
High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture
IBM44 citations96
US7135724B2Nov 14, 2006
Structure and method for making strained channel field effect transistor using sacrificial spacer
IBM47 citations96
US7002209B2Feb 21, 2006
MOSFET structure with high mechanical stress in the channel
IBM61 citations96
US6890808B2May 10, 2005
Method and structure for improved MOSFETs using poly/silicide gate height control
IBM60 citations96
US6887751B2May 3, 2005
MOSFET performance improvement using deformation in SOI structure
IBM61 citations96
US6869866B1Mar 22, 2005
Silicide proximity structures for CMOS device performance improvements
IBM53 citations96
US6653678B2Nov 25, 2003
Reduction of polysilicon stress in trench capacitors
IBM47 citations96
US5773362AJun 30, 1998
Method of manufacturing an integrated ULSI heatsink
IBM74 citations96
US5729052AMar 17, 1998
Integrated ULSI heatsink
IBM43 citations96
US6906360B2Jun 14, 2005
Structure and method of making strained channel CMOS transistors having lattice-mismatched epitaxial extension and source and drain regions
IBM55 citations94
US7781800B2Aug 24, 2010
Embedded silicon germanium using a double buried oxide silicon-on-insulator wafer
IBM24 citations93
US7705345B2Apr 27, 2010
High performance strained silicon FinFETs device and method for forming same
IBM52 citations93
US7538391B2May 26, 2009
Curved FINFETs
IBM28 citations93
US7361973B2Apr 22, 2008
Embedded stressed nitride liners for CMOS performance improvement
IBM17 citations93
US7262087B2Aug 28, 2007
Dual stressed SOI substrates
IBM20 citations93
US7223994B2May 29, 2007
Strained Si on multiple materials for bulk or SOI substrates
IBM21 citations93
US7195972B2Mar 27, 2007
Trench capacitor DRAM cell using buried oxide as array top oxide
IBM20 citations93
US7129130B2Oct 31, 2006
Out of the box vertical transistor for eDRAM on SOI
IBM25 citations93
US7102205B2Sep 5, 2006
Bipolar transistor with extrinsic stress layer
IBM32 citations93
US7091563B2Aug 15, 2006
Method and structure for improved MOSFETs using poly/silicide gate height control
IBM16 citations93
US7045873B2May 16, 2006
Dynamic threshold voltage MOSFET on SOI
IBM47 citations93
US7037770B2May 2, 2006
Method of manufacturing strained dislocation-free channels for CMOS
IBM33 citations93
US7029964B2Apr 18, 2006
Method of manufacturing a strained silicon on a SiGe on SOI substrate
IBM15 citations93
US7009237B2Mar 7, 2006
Out of the box vertical transistor for eDRAM on SOI
IBM23 citations93
US6872641B1Mar 29, 2005
Strained silicon on relaxed sige film with uniform misfit dislocation density
IBM16 citations93
US6872620B2Mar 29, 2005
Trench capacitors with reduced polysilicon stress
IBM24 citations93
US6833305B2Dec 21, 2004
Vertical DRAM punchthrough stop self-aligned to storage trench
IBM19 citations93
US6787838B1Sep 7, 2004
Trench capacitor DRAM cell using buried oxide as array top oxide
IBM17 citations93
US6777737B2Aug 17, 2004
Vertical DRAM punchthrough stop self-aligned to storage trench
IBM21 citations93
US6707095B1Mar 16, 2004
Structure and method for improved vertical MOSFET DRAM cell-to-cell isolation
IBM41 citations93
US6534824B1Mar 18, 2003
Self-aligned punch through stop for 6F2 rotated hybrid DRAM cell
IBM18 citations93
LIU YAOCHENG
2 patentsZHU HUILONG
1 patentShowing the top 50 of 232 patents by PatentIndex Score.