P

Inventor

CHIDAMBARRAO DURESETI

US232 patents
⚠️ This page may combine multiple inventors who share the name “CHIDAMBARRAO DURESETI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

47 patents
US7683428B2Mar 23, 2010

Vertical Fin-FET MOS devices

IBM221 citations99
US7247534B2Jul 24, 2007

Silicon device on Si:C-OI and SGOI and method of manufacture

IBM95 citations99
US7198995B2Apr 3, 2007

Strained finFETs and method of manufacture

IBM154 citations99
US6977194B2Dec 20, 2005

Structure and method to improve channel mobility by gate electrode stress modification

IBM225 citations99
US6891192B2May 10, 2005

Structure and method of making strained semiconductor CMOS transistors having lattice-mismatched semiconductor regions underlying source and drain regions

IBM179 citations99
US6881635B1Apr 19, 2005

Strained silicon NMOS devices with embedded source/drain

IBM176 citations99
US6825529B2Nov 30, 2004

Stress inducing spacers

IBM234 citations99
US6717216B1Apr 6, 2004

SOI based field effect transistor having a compressive film in undercut area under the channel and a method of making the device

IBM282 citations99
US7388259B2Jun 17, 2008

Strained finFET CMOS device structures

IBM61 citations98
US7358551B2Apr 15, 2008

Structure and method for improved stress and yield in pFETs with embedded SiGe source/drain regions

IBM76 citations98
US6974981B2Dec 13, 2005

Isolation structures for imposing stress patterns

IBM137 citations98
US6972461B1Dec 6, 2005

Channel MOSFET with strained silicon channel on strained SiGe

IBM97 citations98
US6417572B1Jul 9, 2002

Process for producing metal interconnections and product produced thereby

IBM105 citations98
US7060539B2Jun 13, 2006

Method of manufacture of FinFET devices with T-shaped fins and devices manufactured thereby

IBM123 citations97
US7018551B2Mar 28, 2006

Pull-back method of forming fins in FinFets

IBM84 citations97
US7337420B2Feb 26, 2008

Methodology for layout-based modulation and optimization of nitride liner stress effect in compact models

IBM61 citations96
US7303949B2Dec 4, 2007

High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture

IBM44 citations96
US7135724B2Nov 14, 2006

Structure and method for making strained channel field effect transistor using sacrificial spacer

IBM47 citations96
US7002209B2Feb 21, 2006

MOSFET structure with high mechanical stress in the channel

IBM61 citations96
US6890808B2May 10, 2005

Method and structure for improved MOSFETs using poly/silicide gate height control

IBM60 citations96
US6887751B2May 3, 2005

MOSFET performance improvement using deformation in SOI structure

IBM61 citations96
US6869866B1Mar 22, 2005

Silicide proximity structures for CMOS device performance improvements

IBM53 citations96
US6653678B2Nov 25, 2003

Reduction of polysilicon stress in trench capacitors

IBM47 citations96
US5773362AJun 30, 1998

Method of manufacturing an integrated ULSI heatsink

IBM74 citations96
US5729052AMar 17, 1998

Integrated ULSI heatsink

IBM43 citations96
US6906360B2Jun 14, 2005

Structure and method of making strained channel CMOS transistors having lattice-mismatched epitaxial extension and source and drain regions

IBM55 citations94
US7781800B2Aug 24, 2010

Embedded silicon germanium using a double buried oxide silicon-on-insulator wafer

IBM24 citations93
US7705345B2Apr 27, 2010

High performance strained silicon FinFETs device and method for forming same

IBM52 citations93
US7538391B2May 26, 2009

Curved FINFETs

IBM28 citations93
US7361973B2Apr 22, 2008

Embedded stressed nitride liners for CMOS performance improvement

IBM17 citations93
US7262087B2Aug 28, 2007

Dual stressed SOI substrates

IBM20 citations93
US7223994B2May 29, 2007

Strained Si on multiple materials for bulk or SOI substrates

IBM21 citations93
US7195972B2Mar 27, 2007

Trench capacitor DRAM cell using buried oxide as array top oxide

IBM20 citations93
US7129130B2Oct 31, 2006

Out of the box vertical transistor for eDRAM on SOI

IBM25 citations93
US7102205B2Sep 5, 2006

Bipolar transistor with extrinsic stress layer

IBM32 citations93
US7091563B2Aug 15, 2006

Method and structure for improved MOSFETs using poly/silicide gate height control

IBM16 citations93
US7045873B2May 16, 2006

Dynamic threshold voltage MOSFET on SOI

IBM47 citations93
US7037770B2May 2, 2006

Method of manufacturing strained dislocation-free channels for CMOS

IBM33 citations93
US7029964B2Apr 18, 2006

Method of manufacturing a strained silicon on a SiGe on SOI substrate

IBM15 citations93
US7009237B2Mar 7, 2006

Out of the box vertical transistor for eDRAM on SOI

IBM23 citations93
US6872641B1Mar 29, 2005

Strained silicon on relaxed sige film with uniform misfit dislocation density

IBM16 citations93
US6872620B2Mar 29, 2005

Trench capacitors with reduced polysilicon stress

IBM24 citations93
US6833305B2Dec 21, 2004

Vertical DRAM punchthrough stop self-aligned to storage trench

IBM19 citations93
US6787838B1Sep 7, 2004

Trench capacitor DRAM cell using buried oxide as array top oxide

IBM17 citations93
US6777737B2Aug 17, 2004

Vertical DRAM punchthrough stop self-aligned to storage trench

IBM21 citations93
US6707095B1Mar 16, 2004

Structure and method for improved vertical MOSFET DRAM cell-to-cell isolation

IBM41 citations93
US6534824B1Mar 18, 2003

Self-aligned punch through stop for 6F2 rotated hybrid DRAM cell

IBM18 citations93

LIU YAOCHENG

2 patents

ZHU HUILONG

1 patent

Showing the top 50 of 232 patents by PatentIndex Score.