P

Inventor

SARAN MUKUL

US15 patents
⚠️ This page may combine multiple inventors who share the name “SARAN MUKUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

14 patents
US6232662B1May 15, 2001

System and method for bonding over active integrated circuits

TEXAS INSTRUMENTS INC153 citations98
US6143396ANov 7, 2000

System and method for reinforcing a bond pad

TEXAS INSTRUMENTS INC130 citations98
US6818540B2Nov 16, 2004

Fine pitch system and method for reinforcing bond pads in semiconductor devices

TEXAS INSTRUMENTS INC59 citations94
US6448650B1Sep 10, 2002

Fine pitch system and method for reinforcing bond pads in semiconductor devices

TEXAS INSTRUMENTS INC57 citations94
US6625882B1Sep 30, 2003

System and method for reinforcing a bond pad

TEXAS INSTRUMENTS INC28 citations92
US5998296ADec 7, 1999

Method of forming contacts and vias in semiconductor

TEXAS INSTRUMENTS INC28 citations90
US7727801B2Jun 1, 2010

Apparatus for improved power distribution in wirebond semiconductor packages

TEXAS INSTRUMENTS INC12 citations84
US6617208B2Sep 9, 2003

High capacitance damascene capacitors

TEXAS INSTRUMENTS INC17 citations84
US6873040B2Mar 29, 2005

Semiconductor packages for enhanced number of terminals, speed and power performance

TEXAS INSTRUMENTS INC11 citations74
US7151309B2Dec 19, 2006

Apparatus for improved power distribution in wirebond semiconductor packages

TEXAS INSTRUMENTS INC4 citations73
US6443743B1Sep 3, 2002

Method for reducing via resistance in small high aspect ratio holes filled using aluminum extrusion

TEXAS INSTRUMENTS INC9 citations73
US6189209B1Feb 20, 2001

Method for reducing via resistance in small high aspect ratio holes filled using aluminum extrusion

TEXAS INSTRUMENTS INC9 citations73
US7338837B2Mar 4, 2008

Semiconductor packages for enhanced number of terminals, speed and power performance

TEXAS INSTRUMENTS INC4 citations63
US7534630B2May 19, 2009

Method of improving power distribution in wirebond semiconductor packages

TEXAS INSTRUMENTS INC2 citations62

NORTHERN TELECOM LTD

1 patent