P

Inventor

LIU SHENG TSUNG

TW19 patents

Patents

19 patents
US7005750B2Feb 28, 2006

Substrate with reinforced contact pad structure

ADVANCED SEMICONDUCTOR ENG155 citations98
US6486535B2Nov 26, 2002

Electronic package with surface-mountable device built therein

ADVANCED SEMICONDUCTOR ENG61 citations96
US7425755B2Sep 16, 2008

Semiconductor package, method for manufacturing the same and lead frame for use in the same

ADVANCED SEMICONDUCTOR ENG35 citations92
US7279784B2Oct 9, 2007

Semiconductor package

ADVANCED SEMICONDUCTOR ENG55 citations92
US6833512B2Dec 21, 2004

Substrate board structure

ADVANCED SEMICONDUCTOR ENG21 citations92
US6423908B1Jul 23, 2002

Substrate for use in forming electronic package

ADVANCED SEMICONDUCTOR ENG23 citations92
US6320757B1Nov 20, 2001

Electronic package

ADVANCED SEMICONDUCTOR ENG26 citations92
US6713836B2Mar 30, 2004

Packaging structure integrating passive devices

ADVANCED SEMICONDUCTOR ENG43 citations89
US6429536B1Aug 6, 2002

Semiconductor device

ADVANCED SEMICONDUCTOR ENG52 citations89
US7315085B2Jan 1, 2008

Ball grid array package and method thereof

ADVANCED SEMICONDUCTOR ENG14 citations84
US7268437B2Sep 11, 2007

Semiconductor package with encapsulated passive component

ADVANCED SEMICONDUCTOR ENG15 citations84
US7245011B2Jul 17, 2007

Prevention of contamination on bonding pads of wafer during SMT

ADVANCED SEMICONDUCTOR ENG15 citations84
US7180181B2Feb 20, 2007

Mesh shaped dam mounted on a substrate

ADVANCED SEMICONDUCTOR ENG17 citations82
US7091607B2Aug 15, 2006

Semiconductor package

ADVANCED SEMICONDUCTOR ENG7 citations73
US7045902B2May 16, 2006

Circuitized substrate for fixing solder beads on pads

ADVANCED SEMICONDUCTOR ENG9 citations73
US6833611B2Dec 21, 2004

Semiconductor device

ADVANCED SEMICONDUCTOR ENG12 citations70
US6509207B1Jan 21, 2003

Soldering method and apparatus for a chip and electronic devices

ADVANCED SEMICONDUCTOR ENG4 citations62
US7939921B2May 10, 2011

Leadframe

ADVANCED SEMICONDUCTOR ENG1 citations52
US7326590B2Feb 5, 2008

Method for manufacturing ball grid array package

ADVANCED SEMICONDUCTOR ENG0 citations41