Inventor
GARCIA SAM S
US14 patents
⚠️ This page may combine multiple inventors who share the name “GARCIA SAM S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
7 patentsUS6924232B2Aug 2, 2005
Semiconductor process and composition for forming a barrier material overlying copper
FREESCALE SEMICONDUCTOR INC36 citations92
US7422979B2Sep 9, 2008
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof
FREESCALE SEMICONDUCTOR INC14 citations82
US8003517B2Aug 23, 2011
Method for forming interconnects for 3-D applications
FREESCALE SEMICONDUCTOR INC2 citations61
US7807572B2Oct 5, 2010
Micropad formation for a semiconductor
FREESCALE SEMICONDUCTOR INC2 citations61
US7572723B2Aug 11, 2009
Micropad for bonding and a method therefor
FREESCALE SEMICONDUCTOR INC6 citations61
US7410544B2Aug 12, 2008
Method for cleaning electroless process tank
FREESCALE SEMICONDUCTOR INC1 citations51
US7932175B2Apr 26, 2011
Method to form a via
FREESCALE SEMICONDUCTOR INC1 citations50
MOTOROLA INC
5 patentsUS6187682B1Feb 13, 2001
Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material
MOTOROLA INC94 citations97
US6093966AJul 25, 2000
Semiconductor device with a copper barrier layer and formation thereof
MOTOROLA INC116 citations94
US6294458B1Sep 25, 2001
Semiconductor device adhesive layer structure and process for forming structure
MOTOROLA INC36 citations92
US6451181B1Sep 17, 2002
Method of forming a semiconductor device barrier layer
MOTOROLA INC36 citations87
US6476623B1Nov 5, 2002
Percent backsputtering as a control parameter for metallization
MOTOROLA INC1 citations50