Inventor
KAWASE YASUHIRO
JP28 patents
⚠️ This page may combine multiple inventors who share the name “KAWASE YASUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI CHEM CORP
13 patentsUS9508648B2Nov 29, 2016
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
MITSUBISHI CHEM CORP6 citations81
US7621281B2Nov 24, 2009
Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
MITSUBISHI CHEM CORP7 citations73
US5759736AJun 2, 1998
Photoresist composition
MITSUBISHI CHEM CORP9 citations73
US9847298B2Dec 19, 2017
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
MITSUBISHI CHEM CORP3 citations70
US9822294B2Nov 21, 2017
Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
MITSUBISHI CHEM CORP3 citations70
US11066627B2Jul 20, 2021
Cleaning agent composition for semiconductor device substrate, method of cleaning semiconductor device substrate, method of manufacturing semiconductor device substrate, and semiconductor device substrate
MITSUBISHI CHEM CORP0 citations62
US5698362ADec 16, 1997
1,2 quinone diazide photosensitive resin composition containing select additive and method for forming a photoresist pattern
MITSUBISHI CHEM CORP6 citations62
US7407569B2Aug 5, 2008
Gold plating solution and gold plating method
MITSUBISHI CHEM CORP3 citations60
US11597896B2Mar 7, 2023
Cleaning liquid, cleaning method, and method for producing semiconductor wafer
MITSUBISHI CHEM CORP0 citations59
US7906004B2Mar 15, 2011
Method of forming oxide film by anodically oxidizing in an electrolyte solution
MITSUBISHI CHEM CORP0 citations50
US10400151B2Sep 3, 2019
Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said composition
MITSUBISHI CHEM CORP0 citations49
US10125289B2Nov 13, 2018
Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device
MITSUBISHI CHEM CORP0 citations37
US9960092B2May 1, 2018
Interlayer filler composition for three-dimensional integrated circuit
MITSUBISHI CHEM CORP0 citations36
OHMI TADAHIRO
5 patentsUS9476137B2Oct 25, 2016
Metal oxide film, laminate, metal member and process for producing the same
OHMI TADAHIRO6 citations84
US8206833B2Jun 26, 2012
Metal oxide film, laminate, metal member and process for producing the same
OHMI TADAHIRO8 citations84
US8124240B2Feb 28, 2012
Protective film structure of metal member, metal component employing protective film structure, and equipment for producing semiconductor or flat-plate display employing protective film structure
OHMI TADAHIRO10 citations83
US8282807B2Oct 9, 2012
Metal member having a metal oxide film and method of manufacturing the same
OHMI TADAHIRO4 citations61
US8642187B2Feb 4, 2014
Structural member to be used in apparatus for manufacturing semiconductor or flat display, and method for producing the same
OHMI TADAHIRO0 citations50
DENSO CORP
5 patentsUS10731770B2Aug 4, 2020
Electric flow control valve and actuator
DENSO CORP3 citations73
US7870733B2Jan 18, 2011
Fluid machine for rankine cycle
DENSO CORP3 citations63
US11391499B2Jul 19, 2022
Heat pump cycle device and valve device
DENSO CORP0 citations51
US11225125B2Jan 18, 2022
Integrated valve device
DENSO CORP0 citations51
US9358967B2Jun 7, 2016
Rotary pump and braking system having the same
DENSO CORP1 citations51