Inventor
CHAN KAI CHONG
SG13 patents
⚠️ This page may combine multiple inventors who share the name “CHAN KAI CHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
5 patentsUS7619304B2Nov 17, 2009
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
INFINEON TECHNOLOGIES AG43 citations92
US7816235B2Oct 19, 2010
Semiconductor package and method for producing the same
INFINEON TECHNOLOGIES AG14 citations82
US7452747B2Nov 18, 2008
Semiconductor package with contact support layer and method to produce the package
INFINEON TECHNOLOGIES AG9 citations82
US8003448B2Aug 23, 2011
Semiconductor package and method for producing the same
INFINEON TECHNOLOGIES AG0 citations51
US7535111B2May 19, 2009
Semiconductor component with semiconductor chip and adhesive film, and method for its production
INFINEON TECHNOLOGIES AG0 citations51
GLOBALFOUNDRIES SG PTE LTD
5 patentsUS9768089B2Sep 19, 2017
Wafer stack protection seal
GLOBALFOUNDRIES SG PTE LTD8 citations82
US8048761B2Nov 1, 2011
Fabricating method for crack stop structure enhancement of integrated circuit seal ring
GLOBALFOUNDRIES SG PTE LTD11 citations80
US9761561B2Sep 12, 2017
Edge structure for backgrinding asymmetrical bonded wafer
GLOBALFOUNDRIES SG PTE LTD5 citations71
US11444045B2Sep 13, 2022
Bonding structures of semiconductor devices
GLOBALFOUNDRIES SG PTE LTD1 citations62
US7892963B2Feb 22, 2011
Integrated circuit packaging system and method of manufacture thereof
GLOBALFOUNDRIES SG PTE LTD4 citations58