Inventor
KIM SUKU
US9 patents
⚠️ This page may combine multiple inventors who share the name “KIM SUKU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KIM SUKU
4 patentsUS8072027B2Dec 6, 2011
3D channel architecture for semiconductor devices
KIM SUKU3 citations57
US8158506B2Apr 17, 2012
Methods and designs for localized wafer thinning
KIM SUKU2 citations56
US8129778B2Mar 6, 2012
Semiconductor devices and methods for making the same
KIM SUKU1 citations49
US8624393B2Jan 7, 2014
Methods and designs for localized wafer thinning
KIM SUKU0 citations45
FAIRCHILD SEMICONDUCTOR
3 patentsUS7960800B2Jun 14, 2011
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
FAIRCHILD SEMICONDUCTOR5 citations72
US8343852B2Jan 1, 2013
Method and structure for dividing a substrate into individual devices
FAIRCHILD SEMICONDUCTOR2 citations60
US7951688B2May 31, 2011
Method and structure for dividing a substrate into individual devices
FAIRCHILD SEMICONDUCTOR1 citations50
GRUENHAGEN MICHAEL D
2 patentsUS8058732B2Nov 15, 2011
Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same
GRUENHAGEN MICHAEL D10 citations81
US8598035B2Dec 3, 2013
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
GRUENHAGEN MICHAEL D3 citations60