Inventor

CHUANG MING-CHIN

TW4 patents

Patents

4 patents

US9900996B2Feb 20, 2018

Package substrate and structure

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71

US9842771B2Dec 12, 2017

Semiconductor device and fabrication method thereof and semiconductor structure

SILICONWARE PRECISION INDUSTRIES CO LTD3 citations71

US9607963B2Mar 28, 2017

Semiconductor device and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50

US9520351B2Dec 13, 2016

Packaging substrate and package structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50