Inventor
JOHNSON MARK S
US49 patents
⚠️ This page may combine multiple inventors who share the name “JOHNSON MARK S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
34 patentsUS6549821B1Apr 15, 2003
Stereolithographic method and apparatus for packaging electronic components and resulting structures
MICRON TECHNOLOGY INC145 citations99
US6208519B1Mar 27, 2001
Thermally enhanced semiconductor package
MICRON TECHNOLOGY INC176 citations99
US6294825B1Sep 25, 2001
Asymmetrical mold of multiple-part matrixes
MICRON TECHNOLOGY INC56 citations96
US6143581ANov 7, 2000
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
MICRON TECHNOLOGY INC41 citations96
US7071421B2Jul 4, 2006
Stacked microfeature devices and associated methods
MICRON TECHNOLOGY INC39 citations94
US7132734B2Nov 7, 2006
Microelectronic component assemblies and microelectronic component lead frame structures
MICRON TECHNOLOGY INC17 citations93
US6909929B2Jun 21, 2005
Stereolithographic method and apparatus for packaging electronic components
MICRON TECHNOLOGY INC19 citations93
US6033614AMar 7, 2000
Manual pellet loader for Boschman automolds
MICRON TECHNOLOGY INC41 citations93
US7655508B2Feb 2, 2010
Overmolding encapsulation process and encapsulated article made therefrom
MICRON TECHNOLOGY INC11 citations84
US7742313B2Jun 22, 2010
Stacked microfeature devices
MICRON TECHNOLOGY INC8 citations82
US7632747B2Dec 15, 2009
Conductive structures for microfeature devices and methods for fabricating microfeature devices
MICRON TECHNOLOGY INC5 citations74
US7608788B2Oct 27, 2009
Plating buss and a method of use thereof
MICRON TECHNOLOGY INC6 citations74
US7298025B2Nov 20, 2007
Microelectronic component assemblies and microelectronic component lead frame structures
MICRON TECHNOLOGY INC5 citations74
US7181837B2Feb 27, 2007
Plating buss and a method of use thereof
MICRON TECHNOLOGY INC4 citations74
US7151013B2Dec 19, 2006
Semiconductor package having exposed heat dissipating surface and method of fabrication
MICRON TECHNOLOGY INC10 citations74
US6820525B2Nov 23, 2004
Precision Fiducial
MICRON TECHNOLOGY INC6 citations74
US6632575B1Oct 14, 2003
Precision fiducial
MICRON TECHNOLOGY INC8 citations74
US6601294B1Aug 5, 2003
Method for making a packaged semiconductor device
MICRON TECHNOLOGY INC5 citations74
US6541856B2Apr 1, 2003
Thermally enhanced high density semiconductor package
MICRON TECHNOLOGY INC8 citations74
US6417018B1Jul 9, 2002
Asymmetrical molding method for multiple part matrixes
MICRON TECHNOLOGY INC12 citations74
US7247520B2Jul 24, 2007
Microelectronic component assemblies and microelectronic component lead frame structures
MICRON TECHNOLOGY INC3 citations63
US6605331B1Aug 12, 2003
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
MICRON TECHNOLOGY INC1 citations63
US6537853B1Mar 25, 2003
Overmolding encapsulation process
MICRON TECHNOLOGY INC2 citations63
US11887970B2Jan 30, 2024
Stacked microfeature devices and associated methods
MICRON TECHNOLOGY INC0 citations60
US11373979B2Jun 28, 2022
Stacked microfeature devices and associated methods
MICRON TECHNOLOGY INC0 citations60
US10062667B2Aug 28, 2018
Stacked microfeature devices and associated methods
MICRON TECHNOLOGY INC1 citations60
US9515046B2Dec 6, 2016
Stacked microfeature devices and associated methods
MICRON TECHNOLOGY INC2 citations60
US9490220B2Nov 8, 2016
Redistribution structures for microfeature workpieces
MICRON TECHNOLOGY INC1 citations52
US7923824B2Apr 12, 2011
Microelectronic component assemblies and microelectronic component lead frame structures
MICRON TECHNOLOGY INC0 citations52
US7652365B2Jan 26, 2010
Microelectronic component assemblies and microelectronic component lead frame structures
MICRON TECHNOLOGY INC0 citations52
US7439450B2Oct 21, 2008
Plating buss and a method of use thereof
MICRON TECHNOLOGY INC0 citations52
US7296346B2Nov 20, 2007
Plating buss and a method of use thereof
MICRON TECHNOLOGY INC0 citations52
US6951981B2Oct 4, 2005
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
MICRON TECHNOLOGY INC0 citations52
US5925384AJul 20, 1999
Manual pellet loader for Boschman automolds
MICRON TECHNOLOGY INC1 citations52
JOHNSON MARK S
4 patentsUSD348365SJul 5, 1994
Display case
JOHNSON MARK S3 citations61
US9313902B2Apr 12, 2016
Conductive structures for microfeature devices and methods for fabricating microfeature devices
JOHNSON MARK S0 citations51
US8946873B2Feb 3, 2015
Redistribution structures for microfeature workpieces
JOHNSON MARK S1 citations51
US8222727B2Jul 17, 2012
Conductive structures for microfeature devices and methods for fabricating microfeature devices
JOHNSON MARK S0 citations51