P

Inventor

JOHNSON MARK S

US49 patents
⚠️ This page may combine multiple inventors who share the name “JOHNSON MARK S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

34 patents
US6549821B1Apr 15, 2003

Stereolithographic method and apparatus for packaging electronic components and resulting structures

MICRON TECHNOLOGY INC145 citations99
US6208519B1Mar 27, 2001

Thermally enhanced semiconductor package

MICRON TECHNOLOGY INC176 citations99
US6294825B1Sep 25, 2001

Asymmetrical mold of multiple-part matrixes

MICRON TECHNOLOGY INC56 citations96
US6143581ANov 7, 2000

Asymmetric transfer molding method and an asymmetric encapsulation made therefrom

MICRON TECHNOLOGY INC41 citations96
US7071421B2Jul 4, 2006

Stacked microfeature devices and associated methods

MICRON TECHNOLOGY INC39 citations94
US7132734B2Nov 7, 2006

Microelectronic component assemblies and microelectronic component lead frame structures

MICRON TECHNOLOGY INC17 citations93
US6909929B2Jun 21, 2005

Stereolithographic method and apparatus for packaging electronic components

MICRON TECHNOLOGY INC19 citations93
US6033614AMar 7, 2000

Manual pellet loader for Boschman automolds

MICRON TECHNOLOGY INC41 citations93
US7655508B2Feb 2, 2010

Overmolding encapsulation process and encapsulated article made therefrom

MICRON TECHNOLOGY INC11 citations84
US7742313B2Jun 22, 2010

Stacked microfeature devices

MICRON TECHNOLOGY INC8 citations82
US7632747B2Dec 15, 2009

Conductive structures for microfeature devices and methods for fabricating microfeature devices

MICRON TECHNOLOGY INC5 citations74
US7608788B2Oct 27, 2009

Plating buss and a method of use thereof

MICRON TECHNOLOGY INC6 citations74
US7298025B2Nov 20, 2007

Microelectronic component assemblies and microelectronic component lead frame structures

MICRON TECHNOLOGY INC5 citations74
US7181837B2Feb 27, 2007

Plating buss and a method of use thereof

MICRON TECHNOLOGY INC4 citations74
US7151013B2Dec 19, 2006

Semiconductor package having exposed heat dissipating surface and method of fabrication

MICRON TECHNOLOGY INC10 citations74
US6820525B2Nov 23, 2004

Precision Fiducial

MICRON TECHNOLOGY INC6 citations74
US6632575B1Oct 14, 2003

Precision fiducial

MICRON TECHNOLOGY INC8 citations74
US6601294B1Aug 5, 2003

Method for making a packaged semiconductor device

MICRON TECHNOLOGY INC5 citations74
US6541856B2Apr 1, 2003

Thermally enhanced high density semiconductor package

MICRON TECHNOLOGY INC8 citations74
US6417018B1Jul 9, 2002

Asymmetrical molding method for multiple part matrixes

MICRON TECHNOLOGY INC12 citations74
US7247520B2Jul 24, 2007

Microelectronic component assemblies and microelectronic component lead frame structures

MICRON TECHNOLOGY INC3 citations63
US6605331B1Aug 12, 2003

Asymmetric transfer molding method and an asymmetric encapsulation made therefrom

MICRON TECHNOLOGY INC1 citations63
US6537853B1Mar 25, 2003

Overmolding encapsulation process

MICRON TECHNOLOGY INC2 citations63
US11887970B2Jan 30, 2024

Stacked microfeature devices and associated methods

MICRON TECHNOLOGY INC0 citations60
US11373979B2Jun 28, 2022

Stacked microfeature devices and associated methods

MICRON TECHNOLOGY INC0 citations60
US10062667B2Aug 28, 2018

Stacked microfeature devices and associated methods

MICRON TECHNOLOGY INC1 citations60
US9515046B2Dec 6, 2016

Stacked microfeature devices and associated methods

MICRON TECHNOLOGY INC2 citations60
US9490220B2Nov 8, 2016

Redistribution structures for microfeature workpieces

MICRON TECHNOLOGY INC1 citations52
US7923824B2Apr 12, 2011

Microelectronic component assemblies and microelectronic component lead frame structures

MICRON TECHNOLOGY INC0 citations52
US7652365B2Jan 26, 2010

Microelectronic component assemblies and microelectronic component lead frame structures

MICRON TECHNOLOGY INC0 citations52
US7439450B2Oct 21, 2008

Plating buss and a method of use thereof

MICRON TECHNOLOGY INC0 citations52
US7296346B2Nov 20, 2007

Plating buss and a method of use thereof

MICRON TECHNOLOGY INC0 citations52
US6951981B2Oct 4, 2005

Asymmetric transfer molding method and an asymmetric encapsulation made therefrom

MICRON TECHNOLOGY INC0 citations52
US5925384AJul 20, 1999

Manual pellet loader for Boschman automolds

MICRON TECHNOLOGY INC1 citations52

JOHNSON MARK S

4 patents

APPLIED MATERIALS INC

2 patents

HOUSTON IND INC

2 patents

OIL DRI CORP OF AMERICA

2 patents

DOW CHEMICAL CO

2 patents

SANDIA CORP

1 patent

WU DIEN-YEH

1 patent

HENG MUNG SUAN

1 patent