P

Inventor

LIU WEI-HSIN

TW23 patents
⚠️ This page may combine multiple inventors who share the name “LIU WEI-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

22 patents
US10249706B1Apr 2, 2019

Semiconductor structure

UNITED MICROELECTRONICS CORP8 citations83
US9754943B1Sep 5, 2017

Dynamic random access memory device

UNITED MICROELECTRONICS CORP8 citations83
US10672864B2Jun 2, 2020

Manufacturing method of semiconductor memory device

UNITED MICROELECTRONICS CORP2 citations72
US10276650B2Apr 30, 2019

Semiconductor memory device and manufacturing method thereof

UNITED MICROELECTRONICS CORP2 citations72
US10643883B2May 5, 2020

Method of forming isolation structure

UNITED MICROELECTRONICS CORP3 citations71
US10453677B2Oct 22, 2019

Method of forming oxide layer

UNITED MICROELECTRONICS CORP2 citations71
US10340278B1Jul 2, 2019

Semiconductor memory device and manufacturing method thereof

UNITED MICROELECTRONICS CORP3 citations70
US9530696B1Dec 27, 2016

Method of fabricating semiconductor device

UNITED MICROELECTRONICS CORP4 citations70
US9793267B1Oct 17, 2017

Semiconductor device having gate structure with reduced threshold voltage and method for manufacturing the same

UNITED MICROELECTRONICS CORP2 citations68
US9589846B1Mar 7, 2017

Method of forming semiconductor device

UNITED MICROELECTRONICS CORP6 citations67
US11088023B2Aug 10, 2021

Method of forming a semiconductor structure

UNITED MICROELECTRONICS CORP0 citations62
US10475900B2Nov 12, 2019

Method for manufacturing a semiconductor device with a cobalt silicide film

UNITED MICROELECTRONICS CORP1 citations62
US10262895B2Apr 16, 2019

Method for forming semiconductor device

UNITED MICROELECTRONICS CORP1 citations62
US10903328B2Jan 26, 2021

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP0 citations61
US10535664B2Jan 14, 2020

Fabricating method of oxide layer within peripheral circuit region

UNITED MICROELECTRONICS CORP1 citations61
US10186453B2Jan 22, 2019

Semiconductor structure and process thereof

UNITED MICROELECTRONICS CORP0 citations52
US9543195B1Jan 10, 2017

Semiconductor process

UNITED MICROELECTRONICS CORP0 citations52
US10312080B2Jun 4, 2019

Method for forming amorphous silicon multuple layer structure

UNITED MICROELECTRONICS CORP0 citations51
US9219151B1Dec 22, 2015

Method for manufacturing silicon nitride layer and method for manufacturing semiconductor structure applying the same

UNITED MICROELECTRONICS CORP1 citations51
US10811272B2Oct 20, 2020

Method of forming stacked structure of memory

UNITED MICROELECTRONICS CORP0 citations48
US10224324B2Mar 5, 2019

Method for manufacturing semiconductor device having gate structure with reduced threshold voltage

UNITED MICROELECTRONICS CORP0 citations48
US10475662B2Nov 12, 2019

Method of forming semiconductor device

UNITED MICROELECTRONICS CORP0 citations41

HUANG PONG-WEY

1 patent