Inventor
BRAUN TANJA
DE6 patents
Patents
6 patentsUS7011989B2Mar 14, 2006
Method for producing encapsulated chips
FRAUNHOFER GES FORSCHUNG21 citations89
US11328987B2May 10, 2022
Waver-level packaging based module and method for producing the same
FRAUNHOFER GES FORSCHUNG2 citations70
US10978778B2Apr 13, 2021
Wafer level package with integrated antennas and means for shielding
FRAUNHOFER GES FORSCHUNG2 citations70
US10461399B2Oct 29, 2019
Wafer level package with integrated or embedded antenna
FRAUNHOFER GES FORSCHUNG5 citations70
US10797375B2Oct 6, 2020
Wafer level package with at least one integrated antenna element
FRAUNHOFER GES FORSCHUNG1 citations59
US10403576B2Sep 3, 2019
Method for manufacturing an electronic component and an electronic component
FRAUNHOFER GES FORSCHUNG0 citations32