Inventor
LEE DAESUK
KR3 patents
Patents
3 patentsUS11380606B2Jul 5, 2022
Semiconductor device including via structure with head and body portions
SAMSUNG ELECTRONICS CO LTD3 citations69
US11798866B2Oct 24, 2023
Semiconductor device including via structures with undercut portions and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11373932B2Jun 28, 2022
Semiconductor packages including through holes and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations49