Inventor
CHEN JIA-LIANG
TW15 patents
⚠️ This page may combine multiple inventors who share the name “CHEN JIA-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBAL UNICHIP CORP
8 patentsUS11658091B2May 23, 2023
Methods of manufacturing semiconductor packaging device and heat dissipation structure
GLOBAL UNICHIP CORP0 citations59
US11450586B2Sep 20, 2022
Heat dissipation structure, semiconductor packaging device, and manufacturing method of the semiconductor packaging device
GLOBAL UNICHIP CORP0 citations59
US11570886B1Jan 31, 2023
Circuit board device
GLOBAL UNICHIP CORP0 citations49
US11862551B2Jan 2, 2024
Interposer and semiconductor package each having conductive terminals on redistribution layer with different pitch
GLOBAL UNICHIP CORP0 citations47
US11742295B2Aug 29, 2023
Interface of integrated circuit die and method for arranging interface thereof
GLOBAL UNICHIP CORP0 citations47
US11201100B2Dec 14, 2021
Solid-state storage device
GLOBAL UNICHIP CORP0 citations46
US9729123B2Aug 8, 2017
Common-mode filter
GLOBAL UNICHIP CORP0 citations39
US9756721B2Sep 5, 2017
Multilayer laminated substrate structure
GLOBAL UNICHIP CORP0 citations32