Inventor
WASEDA TAKAYUKI
JP20 patents
⚠️ This page may combine multiple inventors who share the name “WASEDA TAKAYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
17 patentsUS11935742B2Mar 19, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11626280B2Apr 11, 2023
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11417518B2Aug 16, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP4 citations72
US12581878B2Mar 17, 2026
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12525450B2Jan 13, 2026
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12400874B2Aug 26, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12283478B2Apr 22, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12283476B2Apr 22, 2025
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12033852B2Jul 9, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11894239B2Feb 6, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11335554B2May 17, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations62
US11315800B2Apr 26, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12278103B2Apr 15, 2025
Method of processing substrate and method of manufacturing semiconductor device by forming film
KOKUSAI ELECTRIC CORP0 citations61
US11848203B2Dec 19, 2023
Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12374544B2Jul 29, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11923191B2Mar 5, 2024
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations60
US12424463B2Sep 23, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording medium
KOKUSAI ELECTRIC CORP0 citations59