Inventor

LOW QWAI

US5 patents

⚠️ This page may combine multiple inventors who share the name “LOW QWAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LSI CORP

3 patents

US8384205B2Feb 26, 2013

Electronic device package and method of manufacture

LSI CORP2 citations60

US7531442B2May 12, 2009

Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing

LSI CORP5 citations60

US7993981B2Aug 9, 2011

Electronic device package and method of manufacture

LSI CORP1 citations50

LSI LOGIC CORP

1 patent

US7205673B1Apr 17, 2007

Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing

LSI LOGIC CORP7 citations71

CHIA CHOK

1 patent

US8525309B2Sep 3, 2013

Flip-chip QFN structure using etched lead frame

CHIA CHOK0 citations28