Inventor
DJENNAS FRANK
US6 patents
Patents
6 patentsUS5424576AJun 13, 1995
Semiconductor device having x-shaped die support member and method for making the same
MOTOROLA INC268 citations96
US5327008AJul 5, 1994
Semiconductor device having universal low-stress die support and method for making the same
MOTOROLA INC297 citations96
US5474958ADec 12, 1995
Method for making semiconductor device having no die supporting surface
MOTOROLA INC483 citations95
US5233222AAug 3, 1993
Semiconductor device having window-frame flag with tapered edge in opening
MOTOROLA INC64 citations94
US5734201AMar 31, 1998
Low profile semiconductor device with like-sized chip and mounting substrate
MOTOROLA INC110 citations93
US4883774ANov 28, 1989
Silver flashing process on semiconductor leadframes
MOTOROLA INC20 citations80