Inventor
LIU WEN-CHUN
TW17 patents
⚠️ This page may combine multiple inventors who share the name “LIU WEN-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WALSIN ADVANCED ELECTRONICS
8 patentsUS6762118B2Jul 13, 2004
Package having array of metal pegs linked by printed circuit lines
WALSIN ADVANCED ELECTRONICS32 citations92
US6278182B1Aug 21, 2001
Lead frame type semiconductor package
WALSIN ADVANCED ELECTRONICS40 citations92
US6078099AJun 20, 2000
Lead frame structure for preventing the warping of semiconductor package body
WALSIN ADVANCED ELECTRONICS24 citations90
US6204553B1Mar 20, 2001
Lead frame structure
WALSIN ADVANCED ELECTRONICS40 citations87
US6380062B1Apr 30, 2002
Method of fabricating semiconductor package having metal peg leads and connected by trace lines
WALSIN ADVANCED ELECTRONICS16 citations83
US6262475B1Jul 17, 2001
Lead frame with heat slug
WALSIN ADVANCED ELECTRONICS11 citations73
US6486564B2Nov 26, 2002
Heat dissipation module for a BGA IC
WALSIN ADVANCED ELECTRONICS7 citations70
US6459162B1Oct 1, 2002
Encapsulated semiconductor die package
WALSIN ADVANCED ELECTRONICS3 citations56
IBIS INNOTECH INC
7 patentsUS10256180B2Apr 9, 2019
Package structure and manufacturing method of package structure
IBIS INNOTECH INC37 citations93
US9859193B2Jan 2, 2018
Package structure
IBIS INNOTECH INC2 citations72
US9801282B2Oct 24, 2017
Package structure
IBIS INNOTECH INC2 citations71
US9508634B2Nov 29, 2016
Package structure
IBIS INNOTECH INC3 citations71
US10134668B2Nov 20, 2018
Package structure
IBIS INNOTECH INC1 citations51
US10090256B2Oct 2, 2018
Semiconductor structure
IBIS INNOTECH INC1 citations51
US9451694B2Sep 20, 2016
Package substrate structure
IBIS INNOTECH INC1 citations51