Inventor

JEE YEON-HONG

KR2 patents

Patents

2 patents

US6303999B1Oct 16, 2001

Interconnect structure with a passivation layer and chip pad

SAMSUNG ELECTRONICS CO LTD12 citations68

US6596633B2Jul 22, 2003

Method for manufacturing a semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations46