Inventor
CHEN KUN-CHING
TW20 patents
⚠️ This page may combine multiple inventors who share the name “CHEN KUN-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
19 patentsUS6680529B2Jan 20, 2004
Semiconductor build-up package
ADVANCED SEMICONDUCTOR ENG154 citations98
US6528882B2Mar 4, 2003
Thermal enhanced ball grid array package
ADVANCED SEMICONDUCTOR ENG151 citations98
US6701614B2Mar 9, 2004
Method for making a build-up package of a semiconductor
ADVANCED SEMICONDUCTOR ENG89 citations97
US6191360B1Feb 20, 2001
Thermally enhanced BGA package
ADVANCED SEMICONDUCTOR ENG109 citations97
US6737300B2May 18, 2004
Chip scale package and manufacturing method
ADVANCED SEMICONDUCTOR ENG123 citations95
US7125745B2Oct 24, 2006
Multi-chip package substrate for flip-chip and wire bonding
ADVANCED SEMICONDUCTOR ENG26 citations92
US6750397B2Jun 15, 2004
Thermally enhanced semiconductor build-up package
ADVANCED SEMICONDUCTOR ENG23 citations92
US6423622B1Jul 23, 2002
Lead-bond type chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG40 citations92
US6534852B1Mar 18, 2003
Ball grid array semiconductor package with improved strength and electric performance and method for making the same
ADVANCED SEMICONDUCTOR ENG55 citations90
US6313413B1Nov 6, 2001
Wire structure of substrate for layout detection
ADVANCED SEMICONDUCTOR ENG7 citations72
US6455941B1Sep 24, 2002
Chip scale package
ADVANCED SEMICONDUCTOR ENG13 citations71
US5982625ANov 9, 1999
Semiconductor packaging device
ADVANCED SEMICONDUCTOR ENG15 citations71
US6714421B2Mar 30, 2004
Flip chip package substrate
ADVANCED SEMICONDUCTOR ENG3 citations63
US6551855B1Apr 22, 2003
Substrate strip and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG5 citations63
US6642612B2Nov 4, 2003
Lead-bond type chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG4 citations62
US7061347B2Jun 13, 2006
High frequency substrate comprised of dielectric layers of different dielectric coefficients
ADVANCED SEMICONDUCTOR ENG0 citations51
US6252309B1Jun 26, 2001
Packaged semiconductor substrate
ADVANCED SEMICONDUCTOR ENG0 citations50
US7061084B2Jun 13, 2006
Lead-bond type chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations41
US6190529B1Feb 20, 2001
Method for plating gold to bond leads on a semiconductor substrate
ADVANCED SEMICONDUCTOR ENG0 citations34