Inventor

LEE YIRE-ZINE

TW2 patents

Patents

2 patents

US6204559B1Mar 20, 2001

Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking

ADVANCED SEMICONDUCTOR ENG71 citations94

US6313413B1Nov 6, 2001

Wire structure of substrate for layout detection

ADVANCED SEMICONDUCTOR ENG7 citations72