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Inventor

RUSSELL DAVID JOHN

US27 patents
⚠️ This page may combine multiple inventors who share the name “RUSSELL DAVID JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

22 patents
US6178093B1Jan 23, 2001

Information handling system with circuit assembly having holes filled with filler material

IBM168 citations99
US5822856AOct 20, 1998

Manufacturing circuit board assemblies having filled vias

IBM223 citations99
US6138350AOct 31, 2000

Process for manufacturing a circuit board with filled holes

IBM37 citations96
US6000129ADec 14, 1999

Process for manufacturing a circuit with filled holes

IBM43 citations96
US5876842AMar 2, 1999

Modular circuit package having vertically aligned power and signal cores

IBM85 citations96
US6576382B2Jun 10, 2003

Composition for photoimaging

IBM18 citations92
US6210862B1Apr 3, 2001

Composition for photoimaging

IBM35 citations92
US6127025AOct 3, 2000

Circuit board with wiring sealing filled holes

IBM23 citations92
US5993945ANov 30, 1999

Process for high resolution photoimageable dielectric

IBM35 citations92
US5665650ASep 9, 1997

Method for manufacturing a high density electronic circuit assembly

IBM41 citations92
US5867898AFeb 9, 1999

Method of manufacture multilayer circuit package

IBM18 citations91
US6680440B1Jan 20, 2004

Circuitized structures produced by the methods of electroless plating

IBM14 citations84
US6180317B1Jan 30, 2001

Composition for photoimaging

IBM16 citations82
US6114019ASep 5, 2000

Circuit board assemblies having filled vias free from bleed-out

IBM13 citations82
US6022670AFeb 8, 2000

Process for high resolution photoimageable dielectric

IBM10 citations74
US5985760ANov 16, 1999

Method for manufacturing a high density electronic circuit assembly

IBM9 citations73
US5747223AMay 5, 1998

Composition for photoimaging

IBM11 citations72
US5670750ASep 23, 1997

Electric circuit card having a donut shaped land

IBM12 citations72
US5955782ASep 21, 1999

Apparatus and process for improved die adhesion to organic chip carriers

IBM13 citations69
US8530345B2Sep 10, 2013

Electrical contact alignment posts

IBM1 citations49
US7118837B2Oct 10, 2006

Photoimaged dielectric polymer and film, and circuit package containing the same

IBM0 citations47
US6806033B2Oct 19, 2004

Photoimaged dielectric, its manufacture and use in electronics

IBM0 citations47

BLACKSHEAR EDMUND

1 patent

GLOBALFOUNDRIES INC

1 patent

WEST DAVID JUSTIN

1 patent

ERICSSON TELEFON AB L M

1 patent

ALLARD SYLVIE

1 patent