Inventor
MARCELLO HEIKE
US10 patents
Patents
10 patentsUS6706464B2Mar 16, 2004
Method of fabricating circuitized structures
IBM15 citations92
US6195264B1Feb 27, 2001
Laminate substrate having joining layer of photoimageable material
IBM30 citations92
US6066889AMay 23, 2000
Methods of selectively filling apertures
IBM30 citations92
US5866237AFeb 2, 1999
Organic electronic package and method of applying palladium-tin seed layer thereto
IBM27 citations90
US6680440B1Jan 20, 2004
Circuitized structures produced by the methods of electroless plating
IBM14 citations84
US6835533B2Dec 28, 2004
Photoimageable dielectric epoxy resin system film
IBM5 citations73
US6528218B1Mar 4, 2003
Method of fabricating circuitized structures
IBM12 citations73
US6519843B2Feb 18, 2003
Method of forming a chip carrier by joining a laminate layer and stiffener
IBM12 citations73
US6376158B1Apr 23, 2002
Methods for selectively filling apertures
IBM11 citations73
US6025057AFeb 15, 2000
Organic electronic package and method of applying palladium-tin seed layer thereto
IBM15 citations71