P

Inventor

HUANG SHU-CHEN

TW24 patents
⚠️ This page may combine multiple inventors who share the name “HUANG SHU-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IND TECH RES INST

11 patents
US5710459AJan 20, 1998

Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability

IND TECH RES INST127 citations92
USD380447SJul 1, 1997

Ethernet switching hub

IND TECH RES INST43 citations91
US5557663ASep 17, 1996

Multi-media communication system with integrated and coherent audio-video user interface allowing flexible image input

IND TECH RES INST29 citations91
USD373355SSep 3, 1996

Video telephone

IND TECH RES INST15 citations72
US9540488B1Jan 10, 2017

Siloxane resin composition, and photoelectric device employing the same

IND TECH RES INST3 citations71
US6821818B2Nov 23, 2004

Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly

IND TECH RES INST5 citations62
US8721919B2May 13, 2014

Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefrom

IND TECH RES INST3 citations61
US10717806B2Jul 21, 2020

Packaging material and film

IND TECH RES INST0 citations51
US6841094B2Jan 11, 2005

Fine conductive particles for making anisotropic conductive adhesive composition

IND TECH RES INST0 citations51
US9773958B2Sep 26, 2017

Optical solid state prepolymer and molding composition

IND TECH RES INST0 citations50
US9617411B2Apr 11, 2017

Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same

IND TECH RES INST1 citations50

MATSUSHITA ELECTRIC WORKS LTD

3 patents
US7057277B2Jun 6, 2006

Chip package structure

MATSUSHITA ELECTRIC WORKS LTD53 citations91
US7061103B2Jun 13, 2006

Chip package structure

MATSUSHITA ELECTRIC WORKS LTD14 citations82
US7230331B2Jun 12, 2007

Chip package structure and process for fabricating the same

MATSUSHITA ELECTRIC WORKS LTD8 citations72

SIMPLE GREEN CO LTD

3 patents
US11625691B2Apr 11, 2023

Method for facilitating recycling

SIMPLE GREEN CO LTD2 citations60
US11529820B2Dec 20, 2022

Method for manufacturing wear and tear-indicating product

SIMPLE GREEN CO LTD0 citations39
US10538018B2Jan 21, 2020

Method for manufacturing elastic mat with successive mixed color type

SIMPLE GREEN CO LTD0 citations30

TAIWAN SEMICONDUCTOR MFG

1 patent
US7179664B2Feb 20, 2007

Method for generating work-in-process schedules

TAIWAN SEMICONDUCTOR MFG12 citations82

HUANG SHU CHEN

1 patent
US5260835ANov 9, 1993

Vehicle rear view mirror

HUANG SHU CHEN6 citations70

RISUN EXPANSE CORP

1 patent
US6707223B1Mar 16, 2004

Stator assembly structure

RISUN EXPANSE CORP4 citations62

LIN CHICH-HAW

1 patent
US8440774B2May 14, 2013

Transparent silicone epoxy composition

LIN CHICH-HAW3 citations50

HUANG SHU-CHEN

1 patent
US8784912B2Jul 22, 2014

Fermented composition of mung bean hulls, method for forming thereof, and anti-oxidation and anti-inflammation composition using the same

HUANG SHU-CHEN0 citations44

FOOD IND RES AND DEV INST

1 patent
US9782444B2Oct 10, 2017

Preparation and use of fish skin fermentation liquid obtained by fermenting fish skin with Aspergillus

FOOD IND RES AND DEV INST0 citations42

YEN YEU-SHIH

1 patent
US8609297B2Dec 17, 2013

Flat fuel cell assembly and fabrication thereof

YEN YEU-SHIH0 citations33