Inventor
PARK MYEONG-SOON
KR15 patents
⚠️ This page may combine multiple inventors who share the name “PARK MYEONG-SOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS10840159B2Nov 17, 2020
Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad
SAMSUNG ELECTRONICS CO LTD5 citations84
US10008462B2Jun 26, 2018
Semiconductor package
SAMSUNG ELECTRONICS CO LTD12 citations84
US7875552B2Jan 25, 2011
Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby
SAMSUNG ELECTRONICS CO LTD7 citations84
US7545027B2Jun 9, 2009
Wafer level package having redistribution interconnection layer and method of forming the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US7205660B2Apr 17, 2007
Wafer level chip scale package having a gap and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7312143B2Dec 25, 2007
Wafer level chip scale package having a gap and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US9859204B2Jan 2, 2018
Semiconductor devices with redistribution pads
SAMSUNG ELECTRONICS CO LTD2 citations72
US11705376B2Jul 18, 2023
Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad
SAMSUNG ELECTRONICS CO LTD0 citations62
US11189535B2Nov 30, 2021
Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad
SAMSUNG ELECTRONICS CO LTD0 citations62
US7638365B2Dec 29, 2009
Stacked chip package and method for forming the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US9960112B2May 1, 2018
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51